Gallium nitride light emitting devices on diamond
Gallium nitride devices are formed on a diamond substrate, such as for light emitting diodes as a replacement for incandescent light bulbs and fluorescent light bulbs. In one embodiment, gallium nitride diodes (or other devices) are formed on diamond in at least two methods. A first method comprises growing gallium nitride on diamond and building devices on that gallium nitride layer. The second method involves bonding gallium nitride (device or film) onto diamond and building the device onto the bonded gallium nitride. These devices may provide significantly higher efficiency than incandescent or fluorescent lights, and provide significantly higher light or energy density than other technologies. Similar methods and structures result in other gallium nitride semiconductor devices.
1. A diamond semiconductor device, comprising:
a diamond substrate having hydrogen (H 2 ) implanted to form a compliant layer at a top surface of the diamond substrate; and
a layer of GaN grown on the top compliant surface of the H 2 implanted diamond substrate such that the compliant layer reduces a lattice mismatch between the substrate and the layer of grown GaN.
2. The diamond semiconductor device of claim 1 wherein the GaN is grown using high power RF deposition.
3. The diamond semiconductor device of claim 1 wherein the GaN is grown using microwave deposition.
4. The diamond semiconductor device of claim 1 wherein the concentration of H 2 is between approximately 8×10 16 to 10 17 atoms per cubic centimeter.
5. The diamond semiconductor device of claim 1 wherein the H 2 is implanted with an energy ranging from 50KeV to 1MeV.
6. The diamond semiconductor device of claim 1 wherein the diamond substrate is a monocrystalline diamond.
7. The diamond semiconductor device of claim 6 wherein the top compliant layer has a 111 crystalline orientation.
8. The diamond semiconductor device of claim 1 , further comprising a second layer of diamond grown on the grown layer of GaN.
9. The diamond semiconductor device of claim 8 , further comprising implanting Hydrogen in the second diamond layer.
10. The diamond semiconductor device of claim 9 , further comprising growing a second layer of GaN on the Hydrogen-implanted grown second_diamond layer.
11. The diamond semiconductor device of claim 10 , wherein the second grown layer of GaN is n-type doped or p-type doped.
12. A diamond semiconductor device, comprising:
a diamond substrate with hydrogen implanted to form a compliant layer at a top surface of the diamond substrate;
a layer of p or n doped GaN grown on the compliant top surface of the hydrogen-implanted diamond substrate such that the compliant layer reduces a lattice mismatch between the substrate and the layer of grown GaN;
a second layer of diamond grown on the layer of p or n doped GaN; the second layer of diamond implanted with hydrogen; and
a second layer of n or p doped GaN grown on the second layer of diamond.