IP Library › Granted Patent US 7,442,576
Granted Patent B2
US 7,442,576 · App. 11/276,875 · Granted Oct 28, 2008

Placement of absorbing material in a semiconductor device

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Quick Facts
Patent No.
US 7,442,576
App. No.
11/276,875
Granted
Oct 28, 2008
Kind
B2
Abstract

A semiconductor device is provided that includes a hermetically sealed housing having a top member and a bottom member. A semiconductor die is enclosed within the housing and absorbing material is positioned under the semiconductor die.

Claims (26)

1. A method for depositing absorbing material in a housing of a semiconductor device, comprising the steps of:

positioning the absorbing material in a recess of a bottom member of the housing;

positioning a semiconductor die over the recess including depositing a porous material between the semiconductor die and the absorbing material;

bonding the semiconductor die to a bottom member of the housing; and

hermetically sealing the housing by bonding a top member of the housing to the bottom member of the housing.

2. The method as recited in claim 1 further comprising the step of attaching the absorbing material to the bottom member.

3. The method as recited in claim 1 further comprising the step of attaching the absorbing material to a surface of the semiconductor die.

4. A method for depositing absorbing material in a housing of a semiconductor device, comprising the steps of:

positioning a semiconductor die over an aperture in a bottom member of the housing;

bonding the semiconductor die to the bottom member of the housing;

bonding a top member of the housing to the bottom member of the housing;

positioning the absorbing material in the aperture and depositing a porous material between the semiconductor die and the absorbing material subsequent to bonding the top member to the bottom member; and

hermetically sealing the housing.

5. The method as recited in claim 4 , wherein said hermetically sealing step includes positioning a cap in the aperture over the absorbing material.

6. A method for depositing absorbing material in a semiconductor device, comprising the steps of:

enclosing the absorbing material in a casing, the casing including an aperture;

bonding a semiconductor die to an interior surface of a bottom member of a housing, the bottom member including a port;

bonding the casing on an exterior surface of the bottom member so that the aperture aligns with the port and the semiconductor die is positioned over the absorbing material; and

hermetically sealing the housing by bonding a top member of the housing to the bottom member of the housing.

7. A method for assembling a semiconductor device having a top housing member and a bottom housing member, comprising the steps of:

positioning the absorbing material within a space defined by the bottom housing member and a plurality of mounting pads on the bottom housing member;

depositing a porous material on the absorbing material;

securing a semiconductor die on the mounting pads; and

hermetically sealing the housing by bonding the top housing member to the bottom housing member.

8. The method as recited in claim 7 further comprising the step of attaching the absorbing material to the surface of the bottom housing member.

9. The method as recited in claim 7 further comprising the step of attaching the absorbing material to a bottom surface of the semiconductor die.