Card type LED illumination source
An LED illumination source comprises a heat dissipating substrate which includes a metal plate and at least two insulating layers thereon. LEI) bare chips are mounted on a surface of the substrate. An optical reflector with holes surrounds the LED bare chips. The optical reflector is provided on the surface of the substrate on which the LED bare chips are mounted. A resin encapsulates the entire optical reflector on the substrate, the resin molding each of the LED bare chips and functioning as an optical lens for each of the LED bare chips.
1. An LED illumination source comprising
a heat dissipating substrate comprising a metal plate and an insulating layer provided thereon;
LED bare chips mounted on a surface of the substrate;
an optical reflector with holes to surround the LED bare chips, the optical reflector being provided on the surface of the substrate on which the LED bare chips are mounted; and
a resin for encapsulating the entire of the optical reflector on the substrate, the resin molding each of the LED bare chips and functioning as an optical lens for each of the LED bare chips.
2. The LED illumination source of claim 1 , wherein the substrate includes a line pattern provided thereon and the insulating layer comprises a composite material with an inorganic filler and a resin composition.
3. The LED illumination source of claim 2 , wherein the thermal resistance between the back surface of the metal base substrate, on which none of the LED bare chips is mounted, and the LED bare chips is 10° C./W or less.
4. The LED illumination source of claim 3 , wherein the thermal resistance is 5° C. or less.
5. The LED illumination source of claim 3 , wherein the thermal resistance is 2° C./W or less.
6. The LED illumination source of claim 2 , wherein the inorganic filler comprises at least one material selected from the group consisting of Al 2 O 3 , MgO, BN, SiO 2 , SiC, Si 3 N 4 and AlN.
7. The LED illumination source of claim 1 , wherein the LED bare chips are provided as either surface mount devices (SMDs) or chip elements.