System and method for cooling a module
View Patent ↗Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.
1. A method of mounting a module cooling system, comprising:
connecting electrically a module with a center to a circuit board;
abutting a stiffener to the circuit board on a side of the circuit board opposite a side at which the module is disposed;
abutting a heatsink to the module on a side of the module opposite a side at which the circuit board is connected;
biasing the heatsink in a direction towards the center of the module relative to the stiffener with a single positionally adjustable point of contact of a first biasing member;
fixing the heatsink relative to the stiffener with fasteners; and
biasing the circuit board and module towards the heatsink relative to the stiffener with a single raised surface point of contact as a second biasing member.
2. The method of claim 1 , further comprising:
positioning a thermal interface between the module and the heatsink.
3. The method of claim 1 , further comprising:
forming a raised surface in the stiffener to act as the second biasing member.