Sensor chip breaking strength inspection apparatus and sensor chip breaking strength inspection method
View Patent ↗A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.
1. A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed,
characterized in that said sensor chip breaking strength inspection apparatus comprises:
a stage on which said semiconductor wafer is mounted; and
a nozzle that emits a medium onto said sensor chips at a pressure equivalent to a standard breaking strength of said sensor chips.
2. A sensor chip breaking strength inspection apparatus according to claim 1 , wherein said pressure of said medium that is emitted from said nozzle is greater than or equal to atmospheric pressure.
3. A sensor chip breaking strength inspection apparatus according to claim 1 , wherein said nozzle and said semiconductor wafer are moved relative to each other such that said medium is emitted over an entire surface of said semiconductor wafer.
4. A sensor chip breaking strength inspection apparatus according to claim 1 , wherein a plurality of said nozzles are disposed, and emitting apertures of said nozzles are disposed in a straight line and directed at a surface of said semiconductor wafer.
5. A sensor chip breaking strength inspection apparatus according to claim 1 , wherein an emitting aperture of said nozzle has a doughnut shape.
6. A sensor chip breaking strength inspection apparatus according to claim 1 , wherein a plurality of said nozzles are disposed, and nozzles having a suction aperture surround a nozzle having an emitting aperture.
7. A sensor chip breaking strength inspection apparatus according to claim 6 , wherein said emitting aperture faces said sensor chips.
8. A sensor chip breaking strength inspection apparatus according to claim 1 , further comprising a breakage presence or absence detecting means that detects presence or absence of breakage in said sensor chips after said pressure has been applied to said sensor chips.
9. A sensor chip breaking strength inspection apparatus according to claim 8 , wherein said breakage presence or absence detecting means is an image recognizing apparatus that optically recognizes breakage in said sensor chips.
10. A sensor chip breaking strength inspection apparatus according to claim 8 , wherein said breakage presence or absence detecting means comprises:
electrodes that are disposed on said stage and come into contact with pad portions of a patterned circuit that is formed on a front surface of each of said sensor chips; and
a resistance measuring device that is electrically connected between said electrodes and measures resistance between said pad portions.
11. A sensor chip breaking strength inspection apparatus according to claim 8 , wherein:
said sensor chips have an opaque pattern formed on a front surface; and
said breakage presence or absence detecting means comprises:
a photoemitter that directs light at said sensor chips; and
a photodetector that is disposed on an opposite side of said sensor chips from said photoemitter and detects light from said photoemitter that has passed through said sensor chips.
12. A sensor chip breaking strength inspection apparatus according to claim 8 , wherein said breakage presence or absence detecting means comprises:
a photoemitter that directs light at said sensor chips; and
a photodetector that detects light from said photoemitter that has been reflected by a light-reflecting pattern that is formed on a front surface of said sensor chips.
13. A sensor chip breaking strength inspection apparatus according to claim 8 , wherein said breakage presence or absence detecting means comprises:
a suction pipe that passes through said stage and has a tip portion that is directed at said diaphragm portion; and
a medium detector that is connected to said suction pipe and detects said medium.
14. A sensor chip breaking strength inspection method characterized in that a sensor chip breaking strength inspection is performed while cleaning during or after dicing of a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed, said sensor chip breaking strength inspection being performed by emitting a medium at said sensor chips at a pressure equivalent to a standard breaking strength of said sensor chips.