IP Library Granted Patent US 7,462,800
Granted Patent B2
US 7,462,800 · App. 11/280,090 · Granted Dec 9, 2008

Method of shaping lithographically-produced probe elements

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Quick Facts
Patent No.
US 7,462,800
App. No.
11/280,090
Granted
Dec 9, 2008
Kind
B2
Abstract

A method is provided for shaping tips of lithographically-produced probe elements configured for use in a probe card to establish electrical communication with a contact of a semiconductor device to be tested. The method includes (a) lithographically producing a plurality of probe elements and (b) using a subtractive process, such as laser ablation or micro-electro-discharge machining, to remove material from each tip of the plurality of probe elements to form each tip into a shape well adapted to penetrate a contaminant oxide layer.

Claims (14)

1. A method of processing probe elements configured for use in a probe card, the method comprising the steps of:

lithographically producing a plurality of probe elements, each of the probe elements having a tip portion;

mounting the plurality of probe elemrnts to a support plate; orienting the support plate at a particular angle with respect to a structure used to remove material to form a particular shape to the tip portion of the probe elements that is well adapted to penetrate a contaminant layer of a surface to be probed by the probe elements;

operating the structure in a first pass over the probe elements to form the particular shape to the tip portion of the probe elements;

orienting the support plate and the probe elements for a second pass with respect to the structure in order to form the particular shape to the tip portion of the probe elements; and

operating the structure in a second pass over the probe elements to form the particular shape to the tip portion of the probe elements.

2. The method of claim 1 wherein the structure is a laser ablation device.

3. The method of claim 1 wherein the structure is a micro-electro-discharge machining device.

4. The method of claim 1 further comprising polishing the tip portion of each probe element.

5. The method of claim 4 wherein the polishing step includes chemically polishing the tip portion of the probe element.

6. The method of claim 1 wherein the paticular shape of the tip portion includes at least one of a trapezoid shape, a parabolic shape, a contoured shape, or a pyramid shape.

7. The method of claim 2 further comprising polishing the tip portion of each probe element.

8. The method of claim 7 wherein the polishing step includes chemically polishing the tip portion of the probe element.

9. The method of claim 2 wherein the paticular shape of the tip portion includes at least one of a trapezoid shape, a parabolic shape, a contoured shape, or a pyramid shape.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2006
From: KULICKE AND SOFFA INDUSTRIES, INC.; K&S INTERCONNECT, INC.
To: SV PROBE PTE LTD.
Reel/Frame 017518/0211 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2005
From: TUNABOYLU, BAHADIR; MALANTONIO, EDWARD L.
To: K & S INTERCONNECT, INC.
Reel/Frame 017258/0322 →