Flat panel display (FPD) and method of fabrication
A Flat Panel Display (FDP) includes: a display device arranged on a substrate; an encapsulation substrate adapted to encapsulate the display device; a conductive layer arranged on an outside surface of the encapsulation substrate; an anisotropic conductive material arranged on the conductive layer; and a bezel arranged in contact with the anisotropic conductive material. A method of fabricating an FDP includes: forming a display device on a substrate; encapsulating the substrate with an encapsulation substrate; forming a conductive layer on an outside surface of the encapsulation substrate; forming an anisotropic conductive material on the conductive layer; and mounting the substrate on a bezel such that the bezel contacts the anisotropic conductive material.
1. A Flat Panel Display (FPD) comprising:
a display device arranged on a substrate;
an encapsulation substrate adapted to encapsulate the display device;
a conductive layer arranged on an outside surface of the encapsulation substrate;
an anisotropic conductive material arranged on the conductive layer; and
a bezel arranged in contact with the anisotropic conductive material,
wherein the anisotropic conductive material comprises a zebra structure of a conductive material surrounded on opposite sides by a nonconductive material,
wherein the anisotropic conductive material is arranged only in a non-emission region.
2. The FPD according to claim 1 , wherein the conductive layer comprises a transparent conductive layer.
3. The FPD according to claim 1 , wherein the conductive layer comprises a material selected from a group consisting of Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), Indium Oxide (IO), Tin Oxide (TO), and Zinc Oxide (ZO).
4. The FPD according to claim 1 , wherein the bezel comprises a conductive material.
5. The FPD according to claim 1 , further comprising a pad ground terminal arranged on the substrate.
6. The FPD according to claim 5 , wherein the pad ground terminal is adapted to be connected to the bezel.
7. The FPD according to claim 1 , wherein the display device comprises a Liquid Crystal Display (LCD).
8. The FPD according to claim 7 , wherein the liquid crystal display comprises an In-Plan-Switch (IPS)-mode LCD.
9. A method of fabricating a Flat Panel Display (FPD), the method comprising:
forming a display device on a substrate;
encapsulating the substrate with an encapsulation substrate;
forming a conductive layer on an outside surface of the encapsulation substrate;
forming an anisotropic conductive material on the conductive layer; and
mounting the substrate on a bezel such that the bezel contacts the anisotropic conductive material,
wherein the anisotropic conductive material comprises a zebra structure of a conductive material surrounded on opposite sides by a nonconductive material,
wherein the anisotropic conductive material is formed only in a non-emission region.
10. The method according to claim 9 , wherein the conductive layer comprises a transparent conductive material.
11. The method according to claim 9 , wherein the conductive layer comprises a material selected from a group consisting of Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), Indium Oxide (IO), Tin Oxide (TO), and Zinc Oxide (ZO).
12. The method according to claim 9 , wherein the bezel comprises a conductive material.
13. The method according to claim 9 , further comprising forming a pad ground terminal on the substrate.
14. The method according to claim 13 , wherein the pad ground terminal is adapted to be connected to the bezel.
15. The method according to claim 9 , wherein the display device comprises a Liquid Crystal Display (LCD).
16. The method according to claim 15 , wherein the LCD comprises an In-Plan-Switch (IPS)-mode LCD.