Semiconductor device and manufacturing method of the same

1. A semiconductor device comprising:

a semiconductor chip having first and second principal surfaces which are positioned on opposite sides, a first electrode formed on said first principal surface, and second and third electrodes formed on said second principal surface;

a resin sealing body which seals said semiconductor chip and has first and second principal surfaces positioned on opposite sides, in which the first principal surface of said resin sealing body is positioned on the first principal surface side of said semiconductor chip and the second principal surface of said resin sealing body is positioned on the second principal surface side of said semiconductor chip;

a first conductive member having one end, which is positioned on the first electrode of said semiconductor chip and connected to the first electrode of said semiconductor chip via first connection means, and the other end on the opposite side of the one end, which is positioned on the second principal surface side of the resin sealing body in comparison with the one end and exposed from said resin sealing body;

a second conductive member connected to the second electrode of said semiconductor chip via second connection means; and

a third conductive member connected to the third electrode of said semiconductor chip via third connection means,

wherein the one end of said first conductive member is exposed from the first principal surface of said resin sealing body, said second and third conductive members are exposed from the second principal surface and side surfaces of said resin sealing body, and each of said first, second, and third connection means includes: a stress buffer layer having a function to buffer thermal stress generated by a difference in thermal expansion coefficients between said first, second, and third conductive members and said semiconductor chip; a first connection layer formed on the semiconductor chip side of said stress buffer layer and having a function to connect said stress buffer layer to the first, second, and third electrodes of said semiconductor chip; and a second connection layer formed on the first, second, and third conductive member side of said stress buffer layer and having a function to connect said stress buffer layer to said first, second, and third conductive members.

2. The semiconductor device according to claim 1 ,

wherein said first and second connection layers are metal layers or metal compound layers having a melting point higher than a melting point of fourth connection means which connects said first, second, and third conductive members to electrodes of a printed circuit board, and

said stress buffer layer is a metal layer having a melting point higher than the melting point of the fourth connection means which connects said first, second, and third conductive members to the electrodes of the printed circuit board and having a thermal expansion coefficient between the thermal expansion coefficient of said semiconductor chip and the thermal expansion coefficient of said first, second, and third conductive members or is a metal layer having a melting point higher than the melting point of the fourth connection means which connects said first, second, and third conductive members to the electrodes of the printed circuit board and having yield stress of less than 100 MPa.

3. The semiconductor device according to claim 2 ,

wherein said first and second connection layers are intermetallic compound layers having a melting point of 260° C. or higher, and are formed by reaction between one of Sn, In, Sn—Ag-based, Sn—Cu-based, Sn—Ag—Cu-based, Sn—Zn-based, Sn—Zn—Bi-based, Sn—In-based, In—Ag-based, In—Cu-based, Bi—Sn-based, and Bi—In-based Pb-free solders and at least one metal of Cu, Ag, Ni, and Au at the time of connection.

4. The semiconductor device according to claim 2 ,

wherein said first and second connection layers are Pb-free solder layers having a melting point of 260° C. or higher to 400° C. or lower, and said Pb free solder layers are made of any one of Au—Sn-based alloy, Au—Ge-based alloy, Au—Si-based alloy, Zn—Al-based alloy, Zn—Al—Ge-based alloy, Bi, Bi—Ag-based alloy, Bi—Cu-based alloy, and Bi—Ag—Cu-based alloy.

5. The semiconductor device according to claim 2 ,

wherein said stress buffer layer is a metal layer having a melting point of 260° C. or higher and is made of any one of a Cu/invar alloy/Cu composite material, a Cu/Cu20 composite material, a Cu—Mo alloy, Ti, Mo, and W.

6. The semiconductor device according to claim 2 ,

wherein said stress buffer layer is a metal layer having a melting point of 260° C. or higher and is made of any one of Al, Mg, Ag, Zn, Cu, and Ni.

7. The semiconductor device according to claim 2 ,

wherein said second and third conductive members are protruding from the side surfaces of said resin sealing body.

8. The semiconductor device according to claim 2 ,

wherein the other end of said first conductive member is positioned on a first side surface side of said resin sealing body, and

said second and third conductive members are exposed from the respectively different side surfaces of three side surfaces of said resin sealing body other than said first side surface.

9. The semiconductor device according to claim 2 ,

wherein the other end of said first conductive member is exposed from the second principal surface and a first side surface of said resin sealing body, and

said second and third conductive members are exposed from respectively different side surfaces among three side surfaces of said resin sealing body other than said first side surface.

10. The semiconductor device according to claim 2 ,

wherein said first conductive member includes: a first portion having a part positioned on the first electrode of said semiconductor chip and the other part protruding to outside of said semiconductor chip; a second portion integrally formed with said first portion; and a third portion integrally formed with said second portion and positioned on the second principal surface side of said resin sealing body in comparison with said first portion,

said first portion is exposed from the first principal surface of said resin sealing body, and

said third portion is exposed from said resin sealing body.

11. The semiconductor device according to claim 2 ,

wherein said second portion is an offset part which separates said first portion from said third portion in a thickness direction of said resin sealing body.

12. The semiconductor device according to claim 2 ,

wherein said first conductive member includes: a first portion having a part positioned on the first electrode of said semiconductor chip and the other part protruding to outside of said semiconductor chip; a second portion bending from said first portion toward the second principal surface side of said resin sealing body; and a third portion extending from said second portion in the same direction as the protruding direction of said first portion,

said first portion is exposed from the first principal surface of said resin sealing body, and

said third portion is exposed from said resin sealing body.

13. The semiconductor device according to claim 2 ,

wherein the first electrode of said semiconductor chip is a drain electrode,

the second electrode of said semiconductor chip is a source electrode, and

the third electrode of said semiconductor chip is a gate electrode.