Mask for depositing thin film of flat panel display and method of fabricating the mask
View Patent ↗A mask for depositing a thin film of a flat panel display and a method of fabricating the mask are disclosed. Embodiments of the mask can improve position accuracy and prevent problems caused by thermal expansion of the mask by attaching a reinforcing member and mask pattern units arranged on openings of the reinforcing member using a buffer member. The mask includes a reinforcing member including a plurality of first openings; mask pattern units arranged corresponding to the first openings of the reinforcing member and supported by the reinforcing member; and a buffer member including a plurality of second openings corresponding to the first openings of the reinforcing member, and attaching the reinforcing member to the mask pattern units to support the reinforcing member and the mask pattern units.
1. A mask comprising:
a reinforcing member comprising at least one first opening;
a buffer member comprising at least one second opening corresponding to the first opening, and supporting the reinforcing member, wherein a portion of the buffer member protrudes through the first opening; and
at least one mask pattern unit supported by the portion of the buffer member protruding through the first opening.
2. The mask of claim 1 , wherein the reinforcing member comprises a material having a low coefficient of thermal expansion.
3. The mask of claim 2 , wherein the reinforcing member comprises an invar material.
4. The mask of claim 1 , wherein the buffer member comprises a conductive material.
5. The mask of claim 4 , wherein the buffer member comprises a nickel-cobalt (Ni—Co) alloy layer.
6. The mask of claim 1 , wherein each of the mask pattern units comprise:
a plurality of third openings having a predetermined pattern, wherein the mask is configured to permit deposition of a thin film of the same predetermined pattern on a target substrate; and
a plurality of shielding units, wherein the third openings are defined by the shielding units.
7. A mask frame assembly comprising:
a mask comprising:
at least one mask pattern unit comprising a plurality of first openings having a pattern, wherein the mask is configured to deposit a thin film in the pattern on a target substrate;
a reinforcing member comprising at least one second opening which corresponds to the mask pattern unit; and
a buffer member including at least one third opening corresponding to the second opening, and supporting the reinforcing member, wherein a portion of the buffer member protrudes through the second opening and supports the mask pattern unit; and
a frame including a fourth opening, the frame being configured to receive and support the mask.
8. The assembly of claim 7 , wherein the reinforcing member comprises a material having a low coefficient of thermal expansion.
9. The assembly of claim 7 , wherein the reinforcing member comprises an invar material.
10. The assembly of claim 7 , wherein the buffer member comprises a conductive material.
11. The assembly of claim 7 , wherein the buffer member comprises a nickel-cobalt (Ni—Co) alloy layer.
12. A method of fabricating a mask comprising:
forming a plurality of mask pattern units on a base metal;
forming a masking material on the base metal;
attaching a reinforcing member on the masking material, the reinforcing member comprising openings corresponding to the mask pattern units;
removing portions of the masking material corresponding to the mask pattern units;
attaching the mask pattern units onto the reinforcing member using a buffer member, wherein the buffer member protrudes through the openings in the reinforcing member so as to support the mask pattern units;
separating the base metal from the mask pattern units; and
removing the masking material.
13. The method of claim 12 , wherein the reinforcing member includes a plurality of openings corresponding to the mask pattern units to support the mask pattern units.
14. The method of claim 13 , wherein the reinforcing member comprises a material having low thermal expansion coefficient.
15. The method of claim 14 , wherein the reinforcing member comprises an invar material.
16. The method of claim 12 , wherein forming the mask pattern units comprises using an electroforming method.
17. The method of claim 12 , wherein the buffer member comprises a conductive metal.
18. The method of claim 13 , wherein the buffer member comprises a nickel-cobalt (Ni—Co) alloy layer.
19. The method of claim 12 , further comprising forming the buffer member with an electroplating process.
20. The method of claim 12 , wherein forming the masking material comprises applying a photosensitive layer on the base metal, and exposing some parts corresponding to the mask pattern units.
21. The method of claim 20 , further comprising removing the parts on the masking material corresponding to the mask pattern units through a development process after attaching the reinforcing member onto the masking material and before attaching the mask pattern units onto the reinforcing member.