Method of manufacturing flat panel display device, flat panel display device, and panel of flat panel display device
View Patent ↗A flat panel display device, a panel of a flat panel display device, and a method of manufacturing a flat panel display device, in which a sealing effect and a resistance to a pressure are increased, and sealing is performed using a glass frit are disclosed. In one aspect, the method includes forming at least a light emitting unit on a surface of a substrate, the light emitting unit including a plurality of light emitting elements, preparing a sealing member to be placed opposite the surface of the substrate, applying a glass frit to an opposing surface of either the substrate or the sealing member to be disposed around the light emitting unit, applying a sealant to the opposing surface of either the substrate or the sealing member to enclose the glass frit, combining the substrate and the sealing member via the sealant, and combining the substrate and the sealing member via the glass frit.
1. A method of manufacturing a flat panel display device, the method comprising:
forming at least one light emitting unit on a surface of a substrate, the light emitting unit including a plurality of light emitting elements;
providing a sealing member to be placed opposite to the surface of the substrate;
applying a glass frit to an opposing surface of either the substrate or the sealing member to enclose the light emitting unit;
applying a sealant to the opposing surface of either the substrate or the sealing member to enclose the glass frit;
combining the substrate and the sealing member via the sealant at a first pressure, wherein the substrate and the sealing member are not combined via the glass frit while at the first pressure; and
subsequent to combining the substrate and the sealing member via the sealant, combining the substrate and the sealing member via the glass frit, wherein combining the substrate and the sealing member via the glass frit is performed at a second pressure higher than the first pressure.
2. The method of claim 1 , further comprising applying the glass frit to a first thickness as measured perpendicular to the substrate, and applying the sealant to a second thickness as measured perpendicular to the substrate, the first thickness being less than the second thickness.
3. The method of claim 1 , wherein the combining via the sealant is performed under a vacuum atmosphere at a predetermined vacuum level, and the combining via the glass frit is performed at atmospheric pressure.
4. The method of claim 1 , further comprising:
assembling the sealing member and the substrate at a predetermined vacuum atmosphere; and
hardening the sealant.
5. The method of claim 1 , wherein the combining via the glass frit comprises melting the glass frit and hardening the glass frit at the second pressure higher than the first pressure at which the combining via the sealant is performed.
6. The method of claim 5 , wherein melting the glass frit comprises melting by laser.
7. The method of claim 6 , wherein the combining via the glass frit is performed at atmospheric pressure.
8. The method of claim 1 , wherein the sealant is an ultra-violet hardening sealant.
9. The method of claim 1 , further comprising:
forming a plurality of light emitting units on the substrate; and
applying the glass frit to positions on the sealing member so as to separately enclose each of the light emitting units.
10. The method of claim 1 , further comprising:
forming a plurality of light emitting units on the substrate; and
applying the sealant to a position on the sealing member so as to enclose the light emitting units.
11. The method of claim 1 , wherein the light emitting elements arc organic light emitting elements.
12. A method of manufacturing a flat panel display device, the method comprising:
forming at least one light emitting unit on a surface of a substrate, the light emitting unit including a plurality of light emitting elements;
providing a sealing member to be placed opposite to the surface of the substrate;
applying a glass frit to an opposing surface of either the substrate or the sealing member to enclose the light emitting unit;
applying a sealant to the opposing surface of either the substrate or the sealing member to enclose the glass frit;
combining the substrate and the sealing member via the sealant under a nitrogen gas atmosphere at a first pressure, wherein the substrate and the sealing member are not combined via the glass frit while at the first pressure; and
subsequent to combining the substrate and the sealing member via the sealant, combining the substrate and the sealing member via the glass frit under atmospheric pressure, the first pressure being less than the atmospheric pressure.
13. The method of claim 12 , further comprising applying the glass frit to a first thickness as measured perpendicular to the substrate, and applying the sealant to a second thickness as measured perpendicular to the substrate, the first thickness being less than the second thickness.
14. The method of claim 12 , further comprising:
assembling the sealing member and the substrate under a nitrogen gas atmosphere; and
hardening the sealant.
15. The method of claim 12 , wherein the combining via the glass frit comprises melting the glass frit and hardening the glass frit at the atmospheric pressure higher than the first pressure at which the combining via the sealant is performed.
16. The method of claim 15 , wherein the glass frit is melted by laser.
17. The method of claim 12 , wherein the sealant is an ultra-violet hardening sealant.
18. The method of claim 12 , further comprising:
forming a plurality of light emitting units on the substrate; and
applying the glass frit to positions on the sealing member so as to separately enclose each of the light emitting units.
19. The method of claim 12 , further comprising:
forming a plurality of light emitting units on the substrate; and
applying the sealant to a position on the sealing member so as to enclose the light emitting units.
20. The method of claim 12 , wherein the light emitting elements are organic light emitting elements.