IP Library Granted Patent US 7,425,244
Granted Patent B2
US 7,425,244 · App. 11/283,011 · Granted Sep 16, 2008

Moistening device for sealing envelope flaps

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,425,244
App. No.
11/283,011
Granted
Sep 16, 2008
Kind
B2
Abstract

A moistening device that significantly reduces any loss of contact between the applicator and envelope flap regardless of the thickness of the mail piece or size of the flap, thereby ensuring sufficient wetting of the glue line on the envelope flap with moistening fluid, is provided. A deflection device is added to a portion of the support to which the applicator is secured. The deflection device is located and sized to exert a force on the applicator, causing the applicator to form into a shape that more closely matches the shape of an envelope flap being processed, while also allowing the applicator to flex slightly in multiple directions. This results in little to no loss of contact between the applicator and glue line on the envelope flap, thereby allowing sufficient moistening fluid to be transferred from the applicator to the glue line.

Claims (21)

1. A moistening device for moistening envelope flaps comprising:

an applicator for applying a moistening fluid to a glue line on an envelope flap;

a support piece for holding the applicator; and

a deflection device located between the support piece and the applicator, the deflection device contacting a first portion of the applicator such that the first portion of the applicator is further away from the support piece than a second portion of the applicator that is not contacted by the deflection device.

2. The moistening device of claim 1 , wherein the deflection device comprises a rib that extends along a portion of the support piece.

3. The moistening device of claim 2 , wherein the rib is approximately 2-3 mm high.

4. The moistening device of claim 1 , wherein the deflection device comprises a spring.

5. The moistening device of claim 1 , wherein the deflection device comprises a plurality of ribs arranged in a row.

6. The moistening device of claim 1 , wherein the deflection device is integral to the support piece.

7. A mailing system for processing mail pieces comprising:

a feed deck along which an envelope having an envelope body, an envelope flap and a top edge is fed in a first direction along a path of travel; and

a moistening device, located along the feed deck, for moistening a glue line on the envelope flap, the moistening device comprising:

a stripper blade for separating the envelope flap from the envelope body;

an applicator for applying a moistening fluid to a glue line on an envelope flap;

a support piece for holding the applicator, the support piece secured to an edge of the stripper blade; and

a deflection device located between the support piece and the applicator, the deflection device contacting a first portion of the applicator, the first portion being opposite the top edge of an envelope when an envelope is being processed by the moistening device, such that the first portion of the applicator is further away from the support piece than a second portion of the applicator not contacted by the deflection device, the second portion being near the top edge of an envelope when an envelope is being processed.

8. The mailing system of claim 7 , wherein the deflection device comprises a rib that extends along a portion of the support piece in a direction transverse to the first direction.

9. The mailing system of claim 8 , wherein the rib is approximately 2-3 mm high.

10. The mailing system of claim 7 , wherein the deflection device comprises a spring.

11. The mailing system of claim 7 , wherein the deflection device comprises a plurality of ribs extending in the first direction that are arranged in a row.

12. The mailing system of claim 7 , wherein the deflection device is integral to the support piece.

Assignments (7)
RELEASE OF PATENT SECURITY AGREEMENT Recorded Feb 19, 2025
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: PITNEY BOWES, INC.
Reel/Frame 070256/0396 →
SECURITY AGREEMENT Recorded Feb 7, 2025
From: PITNEY BOWES INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 070149/0954 →
RELEASE OF SECURITY INTEREST Recorded Feb 7, 2025
From: ALTER DOMUS (US) LLC
To: PITNEY BOWES, INC.
Reel/Frame 070154/0532 →
SECURITY INTEREST Recorded Jul 31, 2023
From: PITNEY BOWES, INC.; PITNEY BOWES GLOBAL LOGISTICS LLC
To: ALTER DOMUS (US) LLC
Reel/Frame 064444/0313 →
SECURITY INTEREST Recorded Nov 1, 2019
From: PITNEY BOWES INC.; NEWGISTICS, INC.; BORDERFREE, INC.; TACIT KNOWLEDGE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050905/0640 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2006
From: PARADIS, JASON P.; COLLINGS, PETER T; SYE, CHIPING; ABDUL-RAHIIM, JIHAD
To: PITNEY BOWES INC.
Reel/Frame 017703/0197 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2005
From: PARADIS, JASON P.; COLLINGS, PETER T.; SYE, CHIPING; ABDUL-RAHIM, JIHAS
To: PITNEY BOWES INC.
Reel/Frame 017265/0952 →