Modularized redundant heat sink for dissipating heat generated from chips

1. A heat sink for dissipating heat generated from chips, comprising

An independent L-shaped fin whose sides are provided with at least two elastic pins, and which is provided with a bottom surface for conducting temperature; wherein the fin is provided with at least one slots which are installed with at least one fans, wherein a projection having a through-hole is extended from a side of fin, an inverted hook of larger outer diameter is located at a lower end of pin, and the inverted hook is latched into a positioning hole which is installed on the circuit board in advance; a spring being sheathed to a shaft of pin, and the shaft being passed through the through-hole, so as to constitute the pin into an elastic member, and a circuit board on which are welded with at least two chips having upper surfaces, wherein a bottom surface of fin is attached to the upper surfaces of at least more than two chips through a heat conduction glue, so as to provide a temperature conducting and heat dissipating to at least two chips by one fin.

2. The modularized heat sink for dissipating heat generated from chips according to claim 1 , wherein the bottom surface of fin can be connected with a heat conducting plate of a thickness, in order to increase a thickness below the bottom surface, thereby providing an attachment to a thinner chip.

3. The modularized heat sink for dissipating heat generated from chips according to claim 1 , wherein two fans can be installed in a single fin, If one fan failed, the other fan will provide adequate air flow to cool down multiple chips.