Method of treating a substrate, method of processing a substrate using a laser beam, and arrangement

1. A method of treating a substrate comprising a body of semiconductor material processed with a laser beam, comprising:

removing from the semiconductor material recast material deposited on said substrate during said laser processing, and at least a part of said body of semiconductor material contiguous to an area processed with a laser beam;

wherein

the removing of said recast material and said part of said contiguous body of semiconductor material comprises an etching,

the etching is controlled to remove both the recast material and a depth of said contiguous semiconductor material, and

said etching control is optimally performed to a depth of the contiguous semiconductor material to remove microcracks formed due to laser processing, resulting in an improvement of mechanical strength of said substrate.

2. The method according to claim 1 , wherein said substrate comprises a score or cut formed during said laser processing.

3. The method according to claim 1 , wherein semiconductor material removed is within a range of at most 10 μm from an exterior surface of said body of semiconductor material, as measured prior to said etching.

4. The method according to claim 1 , wherein the etching is controlled by performing the etching for a duration of time which is optimized for removing said recast material and said part of said semiconductor material.

5. The method according to claim 1 , wherein said semiconductor material comprises at least one member of the group consisting of Si-based semiconductors, In-based semiconductors, Ge-based semiconductors, semi conductors comprising elements selected from group III of the periodic table and elements selected from group V of the periodic table, semiconductors comprising elements selected from group II of the periodic table and elements selected from group IV of the periodic table, semiconductors comprising elements selected from group III of the periodic table and nitride.

6. The method according to claim 1 , wherein the etching is performed using an etch composition comprising at least one selected from the group consisting of NH 4 OH, H 2 O 2 , HCl, H 3 PO 4 , HNO 3 , HF, NaOH, KOH, NaOCl, KOCl, HClO 4 , H 2 SO 4 , (CH 3 ) 4 NOH (tetramethyl ammonium hydroxide (TMAH)), HBr, K 2 Cr 2 O 7 , C 6 H 8 O 7 , HOOCCH 2 CH 2 COOH (succinic acid), Br 2 , organic amines, NH 4 F, solvents and compositions of the above.

7. The method according to claim 6 , wherein said etch composition comprises NH 4 OH:H 2 O 2 :H 2 O in a ratio of a:b:c by volume, wherein a is in a range of 0.4 to 20, b is in a range of 1 to 40, and c is in a range of 10 to 100.

8. The method according to claim 7 , wherein said etch composition comprises NH 4 OH:H 2 O 2 :H 2 O in a ratio of 1.6:25:75 by volume.

9. The method according to claim 1 , further comprising cleaning of said substrate for removing debris from said substrate.

10. The method according to claim 9 , wherein said cleaning of said substrate is performed prior to said etching of said substrate.

11. The method according to claim 1 , wherein said etching is controlled for removing debris from said substrate.

12. The method according to claim 1 , wherein said substrate further comprises a protective coating, and wherein said step of etching is further controlled for removing said protective coating from said substrate.

13. The method according to claim 1 , wherein said processing of said substrate prior to said treating of said substrate comprises at least one selected from the group consisting of scribing, laser cutting, laser dicing, and forming of said substrate using a laser cutting or laser dicing process.

14. The method according to claim 1 , wherein said substrate is selected from the group consisting of a wafer, a semiconductor element separated from a wafer, a diode, a transistor, and an operational amplifier.

15. A method of processing a substrate using a laser beam comprising a treatment method according to claim 1 , wherein said substrate comprises at least a body of semiconductor material.

16. The method according to claim 15 , wherein said substrate is a wafer of semiconductor material.

17. The method according to claim 15 , wherein said method comprises a step of scribing said substrate using said laser beam for forming a score on said substrate.

18. The method according to claim 17 , wherein said substrate is diced by said laser for separating semiconductor elements from said substrate.

19. The method according to claim 15 , wherein prior to said step of processing said substrate, said substrate is mounted on an adhesive tape.

20. The method according to claim 19 , wherein said tape is fixed on a frame.

21. A semiconductor element manufactured using a method according to claim 15 .

22. An arrangement for performing a method according to claim 15 , comprising means for providing a laser beam for processing a substrate of semiconductor material, and means for etching said substrate after processing thereof with said laser beam, wherein said means for etching are arranged for controlling said etching for removing recast material from said substrate and for removing a depth of contiguous semiconductor material of said substrate such that microcracks formed due to laser processing are removed.

23. The method according to claim 5 wherein said semiconductor material comprises at least one selected from the group consisting of GaAs, AlAs, InAs, GaP, AlP, InP, GaSb, AlSb, InSb, InGaAs, AlGaAs, ZnO, ZnS, ZnSe, ZnTe, CdO, CdS, CdSe, CdTe, HgO, HgS, HgSe, HgTe, AlN, GaN, InN, SiGe, SiC, sapphire, and compositions thereof.

24. The process according to claim 6 , wherein the etching is performed using ethylene diamine and pyrocathechol.