Metal polishing composition and method of polishing using the same
A metal polishing composition comprising at least one of the compound represented by formula (1) defined herein and the compound represented by formula (2) defined herein, and an oxidizing agent, and a chemical mechanical polishing method comprising bringing the metal polishing composition into contact with a surface to be polished and providing a relative movement between the surface to be polished and a polishing surface.
1. A metal polishing composition comprising a compound represented by formula (1):
wherein R 1 represents a single bond, an alkylene group or a phenylene group; R 2 and R 3 each independently represent a hydrogen atom, a halogen atom, a carboxyl group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group or an aryl group; and R 4 and R 5 each independently represent a hydrogen atom, a halogen atom, a carboxyl group, an alkyl group or an acyl group provided that when R 1 represents a single bond, R 4 and R 5 do not simultaneously represent a hydrogen atom;
and a compound represented by formula (2):
wherein R 6 represents a single bond, an alkylene group or a phenylene group; R 7 and R 8 each independently represent a hydrogen atom, a halogen atom, a carboxyl group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group or an aryl group; R 9 represents a hydrogen atom, a halogen atom, a carboxyl group or an alkyl group; R 10 represents an alkylene group; with proviso that, when R 10 represents a methylene group, formula (2) satisfies at least one of a condition that R 6 is not a single bond and a condition that R 9 is not a hydrogen atom,
and an oxidizing agent.
2. The metal polishing composition according to claim 1 , further comprising abrasive grains.
3. The metal polishing composition according to claim 2 , wherein the abrasive grains are colloidal silica.
4. The metal polishing composition according to claim 1 , further comprising a compound having an aromatic ring.
5. The metal polishing composition according to claim 4 , wherein the compound having an aromatic ring is a compound selected from a compound represented by formula (I):
wherein R 11 and R 12 each independently represent a hydrogen atom or a substituent, or R 11 and R 12 are connected to each other to form a ring; when R 11 and R 12 both represent a hydrogen atom, the compound of formula (I) includes an enantiomer thereof,
and a compound represented by formula (II):
wherein R 13 , R 14 , R 15 , R 16 , R 17 , and R 18 each independently represent a hydrogen atom or a substituent; any adjacent two of R 13 , R 14 , R 15 , and R 16 may be connected to each other to form a ring; and M + represents a cation.
6. A chemical mechanical polishing method comprising bringing the metal polishing composition according to claim 1 into contact with a surface to be polished and providing a relative movement between the surface to be polished and a polishing surface.