High-frequency, high-signal-density, surface-mount technology footprint definitions
View Patent ↗Methods for designing SMT connector footprints are disclosed. A circuit board may have disposed thereon an arrangement of SMT pads and corresponding vias. The arrangement of vias may differ from the arrangement of SMT pads. The arrangement of SMT pads may differ from the arrangement of contacts in a connector the footprint is designed to receive. The terminal ends of the contacts may be jogged or bent for electrical connection with the SMT pads. The SMT pads and vias may be arranged in a number of ways that increase signal contact density of the board, while limiting cross-talk and providing adequate impedance and routing space on the board. An interactive tool for designing such a footprint is disclosed.
1. An interactive method for defining a surface mount technology (“SMT”) footprint, the method comprising:
receiving first input data that defines a geometry associated with a first SMT footprint;
generating, based on the first input data, first output data indicative of an electrical performance of the first SMT footprint;
after generating the first output data, then receiving second input data that defines a geometry associated with a second SMT footprint; and
generating, based on the second input data, second output data indicative of an electrical performance of the second SMT footprint.
2. The method of claim 1 , wherein at least one of the first and second footprints includes an arrangement of SMT pads and an arrangement of vias, and the arrangement of vias is different from the arrangement of SMT pads.
3. The method of claim 1 , wherein (i) the SMT footprint is adapted to receive an electrical component that includes a plurality of electrically conductive contacts arranged in a contact arrangement; and (ii) at least one of the first and second SMT footprints includes an arrangement of SMT pads that differs from the contact arrangement.
4. The method of claim 3 , wherein at least one of the contacts comprises a contact lead and a terminal portion that jogs away from the contact lead.
5. The method of claim 1 , wherein the input data is received via a computer software application that provides a user interface for receiving the input data.
6. The method of claim 5 , wherein the computer software application is a spreadsheet program.
7. The method of claim 5 , wherein the computer software application generates and displays a visual depiction of at least one of the first and second SMT footprints.
8. The method of claim 1 , wherein the input data includes data corresponding to pair pitch parameters, terminal parameters, ball and pad parameters, and via parameters.
9. The method of claim 1 , wherein at least one of the first and second SMT footprints has a via density greater than 200 via pairs per square inch.
10. A tool for defining a surface mount technology (“SMT”) footprint, the tool comprising:
a user interface for receiving first input data that defines a geometry associated with a first SMT footprint and second input data that defines a geometry associated with a second SMT footprint; and
a processor that (i) receives the first input data; (ii) generates, based on the first input data, first output data indicative of an electrical performance of the first SMT footprint; (iii) receives the second input data after generating the first output data; and (iv) generates, based on the second input data, second output data indicative of an electrical performance of the second SMT footprint.
11. The tool of claim 10 , wherein at least one of the first and second SMT footprints includes an arrangement of SMT pads and an arrangement of vias, and the arrangement of vias is different from the arrangement of SMT pads.
12. The tool of claim 10 , wherein (i) each of the first and second SMT footprints is adapted to receive an electrical component that includes a plurality of electrically conductive contacts arranged in a contact arrangement; and (ii) at least one of the first and second SMT footprints includes an arrangement of SMT pads that differs from the arrangement of contacts.
13. The tool of claim 10 , wherein at least one of the contacts comprises a contact lead and a terminal portion that jogs away from the contact lead.
14. The tool of claim 10 , wherein the user interface comprises a user interface of a computer software application.
15. The tool of claim 10 , wherein the computer software application is a spreadsheet program.
16. The tool of claim 10 , further comprising a user interface for displaying a visual depiction of at least one of the first and second SMT footprints.
17. The tool of claim 16 , wherein a visual depiction of the first SMT footprint is displayed before the second input data is received.
18. The method of claim 10 , wherein the input data includes data corresponding to pair pitch parameters, terminal parameters, ball and pad parameters, and via parameters.
19. The method of claim 10 , wherein at least one of the first and second SMT footprints has a via density greater than 200 via pairs per square inch.
20. An interactive method for defining a surface mount technology (“SMT”) footprint, the method comprising:
receiving first input data that defines a geometry associated with a first SMT footprint;
generating, based on the first input data, a visual depiction of the first SMT footprint;
after generating the visual depiction of the first SMT footprint, then receiving second input data that defines a geometry associated with a second SMT footprint; and
generating, based on the second input data, second output data indicative of an electrical performance of the second SMT footprint.