Substrate for a stamper
View Patent ↗A preparing method for a substrate for a stamper where the entirety of the metal rolled plate can be used as the material for the substrate so that a high yield in the preparation can be maintained is provided. A metal is rolled so as to generate a metal rolled plate, the metal rolled plate that is generated is cut to a predetermined size, and metal plating is operated on the front surface or the rear surface, or both the front and rear surfaces, of the metal rolled plate that has been cut to a predetermined size, and then, a polishing process is operated. A target plate thickness that is set when the metal rolled plate is rolled is smaller than the plate thickness that is required at the time of completion of the polishing process.
1. A substrate for a stamper comprising a plate of metal having a front surface and a rear surface, wherein a degree of purity of a non-metallic inclusion in said plate is no greater than 0.05%, and a metal coating layer is provided on the front surface or the rear surface, or on both of the front and rear surfaces, wherein the plate of metal has a bend, the bend measured as a gap between a first end of the plate and a mold platen, the gap being no less than 0.1 mm, and further wherein the gap is a result of a second end of the plate opposite to the first end being fixed to the mold platen.
2. The substrate of claim 1 , wherein said plate of the metal has at least one main composition as follows: pure nickel, nickel alloys, pure titanium, titanium alloys, stainless steel, iron, iron alloys, pure copper, copper alloys, pure aluminum, aluminum alloys, pure magnesium and magnesium alloys.
3. The substrate of claim 1 , wherein at least one metal coating layer has an exposed polished surface.
4. The substrate of claim 2 , wherein at least one metal coating layer has an exposed polished surface.