Liquid crystal display device including protection pad

1. A liquid crystal display device, comprising:

(a) a liquid crystal display panel having a data pad;

(b) a printed circuit board;

(c) a plurality of flexible printed circuit boards disposed between the liquid crystal display panel and the printed circuit board, a plurality of gaps defined between adjacent ones of the flexible printed circuit boards;

(d) a plurality of driving integrated circuits connected to the liquid crystal display panel,

wherein the liquid crystal display panel includes a first substrate having a first display region and a first non-display region surrounding a periphery of the first display region, a second substrate facing the first substrate, the second substrate having a second display region that exposes the first non-display region of the first substrate, and a liquid crystal layer interposed between the first and second substrates,

wherein the driving integrated circuits are connected to the liquid crystal display panel in the first non-display region of the first substrate, wherein the flexible printed circuit boards are disposed in the first non-display region of the first substrate, and wherein the driving integrated circuits are mounted on the flexible printed circuit boards; and

(e) a plurality of protection pads disposed on the driving integrated circuits and the data pad,

wherein the protection pads are formed from Graphite, each comprise flexible coating layer, and cover the driving integrated circuits without covering the gaps between the adjacent ones of the flexible printed circuit boards.

2. The device of claim 1 , wherein the flexible coating layer comprises a polymer resin.

3. The device according to claim 1 , wherein the protection pad-is pads are flexible.

4. The device according to claim 1 , wherein the protection pads cover the flexible printed circuit boards.

5. The device according to claim 1 , wherein the driving integrated circuits each include a packaged semiconductor.

6. The device according to claim 1 , wherein a thickness of the protection pads is between about 0.1 millimeter and about 0.2 millimeter.

7. The device according to claim 1 , wherein the protection pads are formed of a material with a thermal conductivity between about 400 Watts/meter Kelvin (W/mk) and about 800 W/mk.

8. A method of fabricating a liquid crystal display device, comprising the steps of:

(a) forming a liquid crystal display panel having a data pad;

(b) connecting a plurality of driving integrated circuits to the liquid crystal display panel,

wherein the liquid crystal display panel includes a first substrate having a first display region and a first non-display region surrounding a periphery of the first display region, a second substrate facing the first substrate, the second substrate having a second display region that exposes the first non-display region of the first substrate, and a liquid crystal layer interposed between the first and second substrates, wherein the plurality of driving integrated circuits are connected to the liquid crystal display panel in the first non-display region of the first substrate,

wherein a plurality of flexible printed circuit boards are disposed in the first non-display region of the first substrate and define a plurality of gaps between adjacent ones of the flexible printed circuit boards, and wherein the plurality of driving integrated circuits are mounted on the flexible printed circuit boards;

(c) forming a plurality of protection pads from a material that limits the maximum temperature of the protection pads; and

(d) disposing the protection pads on the driving integrated circuits and the data pad without covering the gaps between the adjacent ones of the flexible printed circuit boards,

wherein the protection pads are formed from Graphite, and each comprise a flexible coating layer.

9. The method according to claim 8 , wherein the step of forming the protection pads on the driving integrated circuits and the data pad includes the steps of forming a sheet of Graphite, and forming a coating layer of polymer resin to attach the protection pads and the driving integrated circuits.

10. The method according to claim 8 , wherein the step of disposing the protection pads on the driving integrated circuits and the data pad includes the step of attaching the protection pads on the driving integrated circuits.

11. A liquid crystal display device, comprising:

(a) a liquid crystal display panel having a data pad;

(b) a printed circuit board;

(c) a plurality of flexible printed circuit boards disposed between the liquid crystal display panel and the printed circuit board, a plurality of gaps defined between adjacent ones of the flexible printed circuit boards;

(d) a plurality of driving integrated circuits connected to the liquid crystal display panel,

wherein the liquid crystal display panel includes a first substrate having a first display region and a first non-display region surrounding a periphery of the first display region, a second substrate facing the first substrate, the second substrate having a second display region that exposes the first non-display region of the first substrate, and a liquid crystal layer interposed between the first and second substrates,

wherein the driving integrated circuits are connected to the liquid crystal display panel in the first non-display region of the first substrate, wherein the flexible printed circuit boards are disposed in the first non-display region of the first substrate, and wherein the driving integrated circuits are mounted on the flexible printed circuit boards; and

(e) a plurality of protection pads disposed on the driving integrated circuits and the data pad, wherein the protection pads are formed from Graphite and each comprise a flexible coating layer,

wherein the printed circuit board and the first substrate have opposing longitudinal edges, the driving integrated circuits disposed between the longitudinal edges of the printed circuit board and the first substrate.

12. The liquid crystal display device according to claim 11 , wherein the protection pads cover the driving integrated circuits without covering the gaps between the adjacent ones of the flexible printed circuit boards.