LED lighting assemblies with thermal overmolding
View Patent ↗One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
1. A lighting assembly comprising:
a plurality of lighting assembly modules each including a printed circuit board, one or more light emitting diodes (LEDs) disposed on the printed circuit board and connectable with electrical connectors disposed with the printed circuit board via circuitry of the printed circuit board, and a free-standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the one or more LEDs, the free-standing high thermal conductivity material having a melting temperature greater than about 100° C. and having a thermal conductivity greater than or about 1 W/m·K; and
flexible electrical conductors interconnecting the lighting assembly modules via the electrical connectors to define a flexible LED-based lighting string.
2. The lighting assembly as set forth in claim 1 , wherein the circuit boards do not include metal cores.
3. The lighting assembly as set forth in claim 1 , wherein the free-standing high thermal conductivity material of the overmolding is a thermoplastic material or a thermoset material.
4. The lighting assembly as set forth in claim 1 , wherein the free-standing high thermal conductivity material overmolding has a shape comporting with molding regions defined by an insert mold that is configured to receive the printed circuit board with the one or more LEDs disposed thereon.
5. The lighting assembly as set forth in claim 1 , wherein each lighting assembly module includes one or more lenses corresponding to and disposed over the one or more LEDs disposed on the printed circuit board, and the free-standing high thermal conductivity material overmolding does not cover at least a portion of each of the one or more lenses.
6. A lighting assembly comprising:
a plurality of LEDs;
a plurality of spaced-apart printed circuit boards, the plurality of LEDs being disposed on the spaced-apart printed circuit boards;
a plurality of thermoplastic overmoldings corresponding to the plurality of printed circuit boards, the thermoplastic overmoldings covering at least portions of the corresponding printed circuit boards proximate to the LEDs disposed on the printed circuit boards, the thermoplastic of the thermoplastic overmoldings having a melting temperature greater than about 100° C. and having a thermal conductivity greater than or about 1 W/m·K;
a flexible electrical cable including a plurality of flexible conductors and insulation surrounding the flexible conductors; and
a plurality of insulation-displacing conductors electrically connected with and secured to each printed circuit board, the plurality of insulation-displacing conductors displacing the cable insulation and electrically connecting with flexible conductors so that the plurality of LEDs disposed on the plurality of printed circuit boards are connectable with a power source via circuitry of the printed circuit boards, the insulation-displacing conductors, and the flexible conductors of the flexible electrical cable.
7. The lighting assembly as set forth in claim 6 , wherein the thermoplastic overmolding of each printed circuit board covers ends of the insulation-displacing connectors secured to the printed circuit board.
8. The lighting assembly as set forth in claim 6 , wherein the lighting assembly further comprises:
a channel letter housing, the plurality of spaced-apart printed circuit boards and at least a portion of the flexible electrical cable being disposed inside the channel letter housing.
9. The lighting assembly as set forth in claim 6 , wherein the thermoplastic of the thermoplastic overmoldings has a thermal conductivity greater than or about 10 W/m·K.
10. The lighting assembly as set forth in claim 6 , wherein the circuit boards do not include metal cores.
11. The lighting assembly as set forth in claim 6 , wherein the thermoplastic overmoldings approximately abut or contact the bases of the LEDs but do not cover light-emitting apertures of the LEDs.
12. The lighting assembly as set forth in claim 6 , wherein the thermoplastic overmoldings substantially cover both principal sides of the printed circuit boards.
13. The lighting assembly as set forth in claim 6 , wherein the thermoplastic overmoldings have a shape comporting with molding regions defined by an insert mold that is configured to receive the printed circuit boards with the LEDs disposed thereon.
14. The lighting assembly as set forth in claim 6 , further comprising:
light-transmissive covers disposed over the LEDs, the thermoplastic overmoldings not covering at least a portion of each light-transmissive cover.
15. The lighting assembly as set forth in claim 14 , wherein the light-transmissive covers are lenses disposed over the LEDs.