Shielded capacitor structure
View Patent ↗A method and apparatus if provided for shielding a capacitor structure formed in a semiconductor device. In a capacitor formed in an integrated circuit, one or more shields are disposed around layers of conductive strips to shield the capacitor. The shields confine the electric fields between the limits of the shields.
1. A high frequency power amplifier formed on a multi layer integrated circuit comprising:
a power amplifier circuit having a capacitor formed between first and second nodes, wherein the capacitor further comprises:
a plurality of conductive layers formed on plurality of metal layers of the integrated circuit, each conductive layer having a plurality conductive strips, wherein the conductive strips in each conductive layer are alternately electrically coupled to the first and second nodes,
a first conductive shield formed on one or more metal layers of the integrated circuit, wherein the first conductive shield is electrically coupled to the first node; and
a second conductive shield formed on one or more metal layers of the integrated circuit, wherein the second conductive shield is electrically coupled to the second node.
2. The high frequency power amplifier of claim 1 , wherein the first conductive shield is disposed above the conductive layers.
3. The high frequency power amplifier of claim 2 , wherein the second conductive shield is disposed below the conductive layers.
4. The high frequency power amplifier of claim 1 , wherein the first conductive shield is disposed to the side of the conductive layers.
5. A power amplifier formed using an integrated circuit comprising:
a power amplifier;
a capacitor formed between first and second nodes, wherein the capacitor further comprises a plurality of conductive layers formed on one or more metal layers of the integrated circuit, each conductive layer having a plurality conductive strips, and wherein the conductive strips in each conductive layer are alternately electrically coupled to the first and second nodes,
a first conductive shield formed on one or more metal layers of the integrated circuit, wherein the first conductive shield is electrically coupled to the first node; and
a second conductive shield formed on one or more metal layers of the integrated circuit, wherein the second conductive shield is electrically coupled to the second node.
6. The power amplifier of claim 5 , wherein the first conductive shield is disposed above the conductive layers.
7. The power amplifier of claim 6 , wherein the second conductive shield is disposed below the conductive layers.
8. The power amplifier of claim 5 , wherein the conductive first shield is disposed to the side of the conductive layers.