Nanowire horizontal growth and substrate removal
View Patent ↗The present invention provides processes for producing horizontal nanowires that are separate and oriented and allow for processing directly on a substrate material. The nanowires grow horizontally by suppressing vertical growth from a nucleating particle, such as a metal film. The present invention also provides for horizontal nanowire growth from nucleating particles on the edges of nanometer-sized steps. Following processing, the nanowires can be removed from the substrate and transferred to other substrates. The present invention also provides for nanowires produced by these processes and electronic devices comprising these nanowires. The present invention also provides for nanowire growth apparatus that provide horizontal nanowires, and processes for producing nanowire devices.
1. A process for producing silicon nanowires, comprising:
(a) providing a base substrate;
(b) forming one or more nucleating particle comprising gold (Au) on the base substrate;
(c) forming a nanowire growth-inhibiting layer on the one or more nucleating particle; and
(d) contacting the nucleating particle with one or more precursor gas mixtures suitable for the growth of silicon nanowires,
whereby silicon nanowires are grown from a side surface of the nucleating particle.
2. The process of claim 1 , further comprising forming a removable layer on the base substrate prior to forming the one or more nucleating particle.
3. The process of claim 2 , further comprising forming a separation layer on the removable layer prior to forming the one or more nucleating particle.
4. The process of claim 1 , further comprising forming a separation layer on the base substrate prior to forming the one or more nucleating particle.
5. The process of claim 3 or claim 4 , further comprising forming the separation layer as an oxide layer.
6. The process of claim 2 , wherein forming the nanowire growth-inhibiting layer on the one or more nucleating particle comprises using photolithography to pattern the growth-inhibiting layer.
7. The process of claim 6 , further comprising (f) depositing a first flexible substrate on the nanowires.
8. The process of claim 7 , further comprising (g) removing the removable layer.
9. The process of claim 8 , further comprising (h) depositing a second flexible substrate on the nanowires opposite the first flexible substrate.
10. The process of claim 1 , further comprising forming the one or more nucleating particle as a plurality of pads by etching a metallic film deposited on the base substrate.
11. The process of claim 1 , further comprising forming the nanowire growth-inhibiting layer as a silicon oxide layer.
12. The process of claim 1 , further comprising forming the base substrate of silicon.
13. The process of claim 1 , wherein the precursor gas mixture comprises SiH 4 , Si 2 H 6 , SiCl 4 or SiH 2 Cl 2 , and further comprises B 2 H 6 , POCl 3 or PH 3 .
14. The process of claim 1 , further comprising (e) depositing a dielectric layer or metallic layer on the surface of the nanowires.
15. The process of claim 14 , further comprising (f) depositing a first flexible substrate material on the nanowires.
16. The process of claim 15 or claim 7 , wherein the first flexible substrate comprises one or more metal contacts.
17. A process for producing a nanowire device, comprising:
(a) providing a base substrate;
(b) forming a removable layer on the base substrate;
(c) forming a separation layer on the removable layer;
(d) forming one or more nucleating particle on the separation layer;
(e) forming a nanowire growth-inhibiting layer on the one or more nucleating particle;
(f) contacting the one or more nucleating particle with one or more precursor gas mixtures, whereby nanowires are grown from a side surface of the one or more nucleating particle;
(g) depositing a dielectric layer or metallic layer on the nanowires;
(h) generating electronic contacts on the separation layer; and
(i) removing the removable layer.
18. The process of claim 17 , wherein the one or more nucleating particle comprises a plurality of pads which have been formed from a metallic film that has been deposited on the base substrate.
19. The process of claim 18 , wherein the metallic film comprises Au, Pt, Fe, Ti, Ga, Ni or Sn.
20. The process of claim 17 , wherein the separation layer is an oxide layer.
21. The process of claim 17 , wherein the nanowire growth-inhibiting layer is silicon oxide.
22. The process of claim 17 , wherein the base substrate comprises silicon.
23. The process of claim 17 , wherein the precursor gas mixture comprises SiH 4 , Si 2 H 6 , SiCl 4 or SiH 2 Cl 2 , and further comprises B 2 H 6 , POCl 3 or PH 3 .