Film bulk acoustic resonator (FBAR) devices with temperature compensation
View Patent ↗The temperature-compensated film bulk acoustic resonator (FBAR) device comprises an FBAR stack that comprises an FBAR characterized by a resonant frequency having a temperature coefficient and a temperature-compensating layer comprising doped silicon dioxide. The FBAR comprises opposed planar electrodes and a piezoelectric element between the electrodes. The piezoelectric element has a temperature coefficient on which the temperature coefficient of the resonant frequency of the FBAR depends at least in part.
1. A temperature-compensated film bulk acoustic resonator (FBAR) device, comprising:
an FBAR stack, comprising:
an FBAR characterized by a resonant frequency having a temperature coefficient, the FBAR comprising opposed planar electrodes and a piezoelectric element between the electrodes, the piezoelectric element having a temperature coefficient on which the temperature coefficient of the resonant frequency depends at least in part, and a temperature-compensating layer between the electrodes comprising doped silicon dioxide.
2. The FBAR device of claim 1 , in which the temperature-compensating layer is juxtaposed with one of the electrodes.
3. The FBAR device of claim 2 , in which the FBAR stack additionally comprises an additional temperature-compensating layer juxtaposed with the other of the electrodes, the additional temperature-compensating layer comprising doped silicon dioxide.
4. The FBAR device of claim 3 , in which the additional temperature-compensating layer is located between the other of the electrodes and the piezoelectric element.
5. The FBAR device of claim 2 , in which the temperature-compensating layer is located between the one of the electrodes and the piezoelectric element.
6. The FBAR device of claim 2 , in which the one of the electrodes is located between the temperature-compensating layer and the piezoelectric element.
7. The FBAR device of claim 2 , in which: the FBAR is a lower FBAR; and the FBAR stack additionally comprises: an upper FBAR stacked on the lower FBAR, the upper FBAR comprising opposed planar electrodes and a piezoelectric element between the electrodes, and an acoustic decoupler between the FBARs.
8. The FBAR device of claim 7 , in which the FBAR stack additionally comprises a temperature-compensating layer juxtaposed with one of the electrodes of each of the FBARs, the temperature-compensating layer comprising doped silicon dioxide.
9. The FBAR device of claim 8 , in which, in each of the FBARs, the one of the electrodes is juxtaposed with the acoustic decoupler.
10. The FBAR device of claim 7 , in which: the first FBAR, the second FBAR and the acoustic decoupler constitute a first decoupled stacked bulk acoustic resonator (DSBAR); the FBAR stack additionally comprises a second DSBAR, comprising a lower FBAR, an upper FBAR stacked on the lower FBAR, and an acoustic decoupler between the FBARs; and the FBAR device additionally comprises: a first electrical circuit interconnecting the lower FBARS, and a second electrieal circuit interconnecting the upper FBARs.
11. The FBAR device of claim 10 , in which the FBAR stack additionally comprises a temperature-compensating layer juxtaposed with one of the electrodes of each of the FBARs, the temperature-compensating layer comprising doped silicon dioxide.
12. The FBAR device of claim 2 , in which: the FBAR is a first FBAR; the FBAR stack additionally comprises one or more additional FBARs; and the FBARs are interconnected as a ladder filter.
13. The FBAR device of claim 12 , in which the FBAR stack additionally comprises a temperature-compensating layer juxtaposed with one of the electrodes of each of the FBARs, the temperature-compensating layer comprising doped silicon dioxide.
14. The FBAR device of claim 1 , in which the temperature-compensating layer is embedded in the piezoelectric element.
15. The FBAR device of claim 14 , in which: the FBAR is a lower FBAR; and the FBAR device additionally comprises: an upper FBAR stacked on the lower FBAR, the upper FBAR comprising opposed planar electrodes and a piezoelectric element between the electrodes, and an acoustic decoupler between the FBARs.
16. The FBAR device of claim 15 , in which the FBAR stack additionally comprises a temperature-compensating layer embedded in the piezoelectric element of each of the FBARs, the temperature-compensating layer comprising doped silicon dioxide.
17. The FBAR device of claim 15 , in which: the lower FBAR, the upper FBAR and the acoustic decoupled constitute a first decoupled stacked bulk acoustic resonator (DSBAR); the FBAR stack additionally comprises a second DSBAR, comprising a lower FBAR, an upper FBAR, an acoustic decoupled between the FBARs; and the FBAR device additionally comprises: a first electrical circuit interconnecting the lower FBARs, and a second electrical circuit interconnecting the upper FBARs.
18. The FBAR device of claim 17 , in which the FBAR stack additionally comprises a temperature-compensating layer embedded in the piezoelectric element of each of the FBARs.
19. The FBAR device of claim 15 , in which: the FBAR is a first FBAR; the FBAR stack additionally comprises one or more additional FBARs; and the FBARs are interconnected as a ladder filter.
20. The FBAR device of claim 19 , in which the FBAR stack additionally comprises a temperature-compensating layer embedded in the piezoelectric element of each of the FBARs, the temperature-compensating layer comprising doped silicon dioxide.
21. The FBAR device of claim 1 , in which: the FBAR is a lower FBAR; the FBAR stack additionally comprises: an upper FBAR stacked on the lower FBAR, and an acoustic decoupler between the FBARs, the acoustic decoupler comprising a Bragg structure; and the temperature-compensating layer constitutes a layer of the Bragg structure.
22. A temperature-compensated film bulk acoustic resonator (FBAR) device, comprising:
an FBAR stack, comprising:
an FBAR characterized by a resonant frequency having a temperature coefficient, the FBAR comprising opposed planar electrodes and a piezoelectric element between the electrodes, the piezoelectric element having a temperature coefficient on which the temperature coefficient of the resonant frequency depends at least in part, and a temperature-compensating layer between the electrodes comprising silicon dioxide doped with a group III element.
23. The FBAR device of claim 22 , in which the group III element is boron.
24. The FBAR device of claim 22 , in which the group III element is one of aluminum, gallium and indium.
25. The FBAR device of claim 22 , in which the silicon dioxide is doped by implanting ions of the group III element.
26. The FBAR device of claim 22 , in which the temperature-compensating layer is fabricated by depositing silicon dioxide by chemical vapor deposition (CVD).
27. The FBAR device of claim 26 , in which the group III element is additionally deposited by CVD.
28. A temperature-compensated film bulk acoustic resonator (FBAR) device, comprising:
a substrate defining a cavity; an FBAR stack suspended over the cavity, the FBAR stack comprising:
an FBAR characterized by a resonant frequency having a temperature coefficient, the FBAR comprising opposed planar electrodes and a piezoelectric element between the electrodes, the piezoelectric element having a temperature coefficient on which the temperature coefficient of the resonant frequency depends at least in pad, and a temperature-compensating layer between the electrodes comprising silicon dioxide implanted with ions of a group III element.
29. The FBAR device of claim 28 , in which the group III element is boron.
30. The FBAR device of claim 28 , in which the group III element is one of aluminum, gallium and indium.
31. A method of making an FBAR device, the method comprising:
providing a substrate having a cavity defined therein, the cavity filled with sacrificial material;
forming an FBAR stack over the sacrificial material, the forming comprising depositing between opposed electrodes a temperature-compensating layer comprising a doped temperature-compensating material; and
removing the sacrificial material from the cavity using an etchant that is incompatible with the temperature-compensating material in its undoped form.
32. The method of claim 31 , in which the doped temperature-compensating material is doped silicon dioxide, the sacrificial material is phosphosilicate glass and the etchant is dilute hydrofluoric acid.
33. The method of claim 32 , in which the silicon dioxide is doped with a group III element.
34. The method of claim 33 , in which the group III element is boron.
35. The method of claim 31 , in which depositing the temperature-compensating layer comprises depositing a layer of silicon dioxide and implanting ions of the group III element into the silicon dioxide.
36. The method of claim 35 , in which the group III element is boron.
37. An acoustic device, comprising an acoustic propagation path having a propagation time-related property, the propagation time-related property having a temperature coefficient, the acoustic propagation path comprising: an acoustic propagation element having a temperature coefficient on which the propagation time-related property of the acoustic propagation path depends at least in part; and a temperature-compensating layer comprising doped silicon dioxide between opposed electrodes, the doped silicon dioxide having a temperature coefficient opposite in sign to the temperature coefficient of the acoustic propagation element.
38. The acoustic device of claim 37 , in which the silicon dioxide is doped with a group III element.