Printed circuit board
View Patent ↗In a printed circuit board on which a first conductor pattern, a second conductor pattern of smaller area than the first conductor pattern and electronic components are mounted, a gap between a first through-hole connected to the first conductor pattern and a first lead pin inserted therein is defined to be larger than that between a second through-hole connected to the second conductor pattern and a second lead pin. With this, it becomes possible to improve solder rise property, without increasing the number of electronic component production processes or degrading strength with respect to the electronic component.
1. A printed circuit board having at least a first conductor pattern, a second conductor pattern whose area is smaller than that of the first conductor pattern, and electronic components having at least a first lead pin and a second lead pin, comprising:
a first through-hole formed to be connected to the first conductor pattern for insertion of the first lead pin; and
a second through-hole formed to be connected to the second conductor pattern for insertion of the second lead pin,
wherein a distance between an inner surface if the though-hole and an outer surface of the first lead pin is made lager than a distance between an inner surface of the second though-hole and an outer surface of the second lead pin.
2. The printed circuit board according to claim 1 , further including:
a plurality of stacked conductor layers, and
a plurality of thermal lands connecting the first conductor pattern formed on each of the plurality of the stacked conductor layers to the first through-hole,
wherein each of the thermal lands formed on the conductor layers located on outer sides of the board is provided with a teardrop region.
3. The printed circuit board according to claim 2 , wherein the thermal land includes:
a land region formed to enclose the first through-hole; and
a linear region connecting the land region with the first conductor pattern,
wherein a length of the linear region is about 0.5 mm.
4. The printed circuit board according to claim 1 , wherein the gap between the first through-hole and the first lead pin is made larger than that between the second through-hole and the second lead pin by 0.2 mm.
5. The printed circuit board according to claim 1 , wherein the electronic component is a transistor module.
6. The printed circuit board according to claim 5 , wherein the first lead pin is an emitter terminal and the second lead pin is a base terminal or a collector terminal.