Printed circuit boards for use in optical transceivers
View Patent ↗One example of an optical transceiver includes a housing and an optical transmitter and optical receiver disposed within the housing. A PCB is also disposed in the housing. The PCB has front and side edges, as well as circuitry in communication with the optical transmitter and the optical receiver. The PCB also includes a group of plated contact pads, each of which includes a front-most extremity that terminates short of the front edge. Finally, the PCB includes a group of traces, one of which leads from one of the side edges of the PCB to a via that is connected with the circuitry, and another of which leads from the via to one of the plated contact pads.
1. An optical transceiver, comprising:
a housing;
an optical transmitter located within the housing;
an optical receiver located within the housing; and
a PCB located within the housing, the PCB comprising:
front and side edges;
circuitry in communication with one of the optical transmitter and the optical receiver;
a plurality of plated contact pads, each of which includes a front-most extremity that terminates short of the front edge; and
a plurality of traces, one of which leads from one of the side edges of the PCB to a via that is connected with the circuitry, and another of which leads from the via to one of the plated contact pads.
2. The optical transceiver as defined in claim 1 , wherein the trace between the via and one of the plated contact pads is formed substantially on an external layer of the PCB.
3. The optical transceiver as defined in claim 1 , wherein the trace between the via and one of the plated contact pads is formed substantially on an internal layer of the PCB.
4. The optical transceiver as defined in claim 1 , wherein the trace between the via and one of the side edges of the PCB is formed on an internal layer of the PCB.
5. The optical transceiver as defined in claim 1 , wherein at least some of the traces reside on different respective layers of the PCB.
6. The optical transceiver as defined in claim 1 , wherein the via connects an external layer of the PCB with an internal layer of the PCB.
7. The optical transceiver as defined in claim 1 , wherein at least one trace runs between a plated contact pad and an edge of the PCB.
8. The optical transceiver as defined in claim 1 , wherein one of the plurality of plated contact pads comprises a portion of a conductive path.
9. The optical transceiver as defined in claim 1 , wherein the plurality of contact pads are gold plated.
10. The optical transceiver as defined in claim 1 , wherein the plurality of traces and plated contact pads are substantially compliant with the Gigabit Interface Converter (GBIC) Multi-Source Agreement (MSA).
11. The optical transceiver as defined in claim 1 , wherein the transceiver is substantially compliant with one of the Small Form Factor Pluggable (SFP) Multi-Source Agreement (MSA); and, the 10 Gigabit Small Form Factor Pluggable (XFP Multi-Source Agreement (MSA).
12. The optical transceiver as defined in claim 8 , wherein the conductive path comprises a high speed transmission line.
13. The optical transceiver as defined in claim 8 , wherein one of the traces runs from the conductive path to a side edge of the PCB.
14. An optical transceiver, comprising:
a housing;
an optical transmitter located within the housing;
an optical receiver located within the housing; and
a PCB located within the housing, the PCB comprising:
front and side edges;
circuitry in communication with one of the optical transmitter and the optical Receiver;
a plurality of plated contacts, each of which includes a front-most extremity that terminates short of the front edge;
a plurality of plated transmission lines, each of which includes a front-most extremity that terminates short of the front edge; and
a plurality of traces, where a first trace connects one of the contacts with a via that is in communication with the circuitry, and where a second trace has a first end connected to the via and a second end connected with a transmission line, the first and second ends of the second trace being electrically isolated from each other.
15. The optical transceiver as recited in claim 14 , wherein the first and second ends of the second trace are electrically isolated from each other by way of an opening that is defined between the first and second ends.
16. The optical transceiver as recited in claim 14 , wherein the second trace is formed on an internal layer of the PCB.
17. The optical transceiver as recited in claim 14 , wherein the second trace is formed on an external layer of the PCB.
18. The optical transceiver as defined in claim 14 , wherein the transceiver is substantially compliant with one of: the Small Form Factor Pluggable (SFP) Multi-Source Agreement (MSA); and, the 10 Gigabit Small Form Factor Pluggable (XFP Multi-Source Agreement (MSA).
19. The optical transceiver as recited in claim 14 , wherein the first trace is substantially wider than the second trace.