IP Library Granted Patent US 7,197,222
Granted Patent B1
US 7,197,222 · App. 11/299,007 · Granted Mar 27, 2007

Waveguide interface

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Quick Facts
Patent No.
US 7,197,222
App. No.
11/299,007
Granted
Mar 27, 2007
Kind
B1
Abstract

Apparatus and associated systems for transmission of signals within a wide bandwidth (e.g., from DC to 40 GHz and above) include a conduction path and ground structures in an arrangement to provide a smooth transition between propagation in a coplanar waveguide mode and propagation in a microstrip waveguide mode. Some embodiments may be provided without vias, for example, by providing low impedance connections between ground structures on different layers, where the connections are made external to a medium between the layers. Some embodiments may feature a monotonically decreasing gap between a signal conduction path and a coplanar ground structure. Such embodiments may be used, for example, to provide a low loss, wide bandwidth interface between a coaxial transmission line and a microstrip transmission line. As another example, one or more such structures may be used in an electro-optic modulator to control an optical signal.

Claims (23)

1. A signal transmission device comprising:

a medium oriented in a first plane;

a signal conduction path that is oriented in a second plane on a first planar side of the first plane, the conduction path comprising firstly, a first portion to conduct signals in a substantially coplanar waveguide mode and secondly, a second portion to conduct signals in a substantially microstrip waveguide mode;

a first ground structure in at least one portion of the second plane, the first ground structure being oriented in relation to the conduction path first portion so that signals passing through the conduction path first portion generate an electric field that is substantially coplanar with the conduction path first portion and the first ground structure; and

a second ground structure in a portion of a third plane on a second planar side of the medium and opposite the first planar side, the second ground structure being oriented in relation to the conduction path second portion and the medium so that signals passing through the conduction path second portion generate an electric field oriented substantially orthogonally to the second plane and extending through the medium,

wherein material deposited along an exterior edge portion of the medium forms at least one low impedance connection between the first and second ground structures.

2. The device of claim 1 , wherein the signal conduction path and the first ground structure are separated by a distance that decreases monotonically from the first portion to the second portion of the conduction path.

3. The device of claim 2 , wherein the distance of separation continuously decreases from the first portion to the second portion of the conduction path.

4. The device of claim 1 , wherein a controlled signal passes through the medium.

5. The device of claim 4 , wherein the controlled signal is controlled in response to the electric field generated by the signals passing through the conduction path second portion.

6. The device of claim 4 , wherein the controlled signal comprises an optical signal.

7. The device of claim 1 , wherein the medium comprises at least one thin layer having a thickness that is less than about 20 microns.

8. The device of claim 7 , wherein the thin layer has a thickness that is between about 7 and about 13 microns.

9. The device of claim 1 , wherein the medium comprises one or more layers having a combined thickness of less than about 250 microns.

10. The device of claim 1 , wherein the at least one low impedance connection between the first and second ground structures comprises a first connection and a second connection that are located on opposite sides of the signal conduction path.

11. An electro-optic modulator device comprising:

a housing;

a medium oriented in a first plane;

a signal conduction path that is oriented in a second plane on a first planar side of the first plane, the conduction path comprising firstly, a first portion to conduct signals in a substantially coplanar waveguide mode and secondly, a second portion to conduct signals in a substantially microstrip waveguide mode;

a first ground structure in at least one portion of the second plane, the first ground structure being oriented in relation to the conduction path first portion so that signals passing through the conduction path first portion generate an electric field that is substantially coplanar with the conduction path first portion and the first ground structure; and

a second ground structure in a portion of a third plane on a second planar side of the medium and opposite the first planar side, the second ground structure being oriented in relation to the conduction path second portion and the medium so that signals passing through the conduction path second portion generate an electric field oriented substantially orthogonally to the second plane and extending through the medium,

wherein material deposited along an exterior edge portion of the medium forms at least one low impedance connection between the first and second ground structures.

12. The electro-optic modulator of claim 11 , wherein the signal conduction path and the first planar return conductor are separated by a distance that decreases monotonically from the first portion to the second portion of the conduction path.

Assignments (2)
SECURITY AGREEMENT Recorded Apr 15, 2011
From: LUMERA CORPORATION
To: SILICON VALLEY BANK
Reel/Frame 026179/0007 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2006
From: KOENIG, MARY K.
To: LUMERA CORPORATION
Reel/Frame 017558/0496 →