Laser ablation prototyping of RFID antennas

1 . A laser ablation radio frequency identification (RFID) antenna prototyping system, comprising:

a substrate;

a conductive ink layer formed on said substrate;

an antenna design module that includes design parameters for an RFID antenna prototype;

an ablation laser; and

a laser driver that communicates with said antenna design module and directs said ablation laser to heat a portion of said conductive ink layer according to said design parameters.

2 . The laser ablation RFID antenna prototyping system of claim 1 further comprising a removal device that removes said portion of said conductive ink layer.

3 . The laser ablation RFID antenna prototyping system of claim 2 wherein said removal device uses an adhesive surface to remove said portion of said conductive ink layer.

4 . The laser ablation RFID antenna prototyping system of claim 2 wherein said removal device removes said portion with a pressurized gas.

5 . The laser ablation RFID antenna prototyping system of claim 2 wherein said ablation laser is configured based on power and a least one of speed, pulses, and height.

6 . The laser ablation RFID antenna prototyping system of claim 5 wherein said power is greater than an ablation threshold, wherein said ablation threshold is when chemical bonds of said conductive ink begin to breakup.

7 . The laser ablation RFID antenna prototype system of claim 6 wherein said power is less than a cutting threshold, wherein said cutting threshold is when said laser cuts through said substrate.

8 . A laser ablation prototyping method for a radio frequency identification (RFID) antenna, comprising:

applying a conductive ink layer on a substrate;

formulating design parameters for an RFID antenna prototype; and

heating a portion of said conductive ink layer according to said design parameters with an ablation laser.

9 . The method of claim 8 further comprising removing said portion of said conductive ink layer.

10 . The method of claim 9 wherein said portion is removed with an adhesive surface.

11 . The method of claim 9 wherein said portion is removed with a pressurized gas.

12 . The method of claim 9 further comprising adjusting power and at least one of speed, pulses, and height to configure said ablation laser.

13 . The method of claim 12 wherein said power is greater than an ablation threshold, wherein said ablation threshold is when chemical bonds of said conductive ink begin to breakup.

14 . The method of claim 13 wherein said power is less than a cutting threshold, wherein said cutting threshold when said laser cuts through said substrate.

15 . A laser ablation prototyping method for a radio frequency identification (RFID) antenna, comprising:

forming a conductive ink layer on a substrate;

formulating design parameters for a RFID antenna prototype;

configuring a power of an ablation laser, wherein said power is greater than an ablation threshold and less than a cutting threshold, wherein said ablation threshold is when chemical bonds of said conductive ink begin to breakup and said cutting threshold is when said laser cuts through said substrate;

applying said ablation laser to said conductive ink layer to heat portions of said conductive ink layer defined by said design parameters; and

removing said portions of said conductive ink layer from said substrate.

16 . The method of claim 15 wherein said portions are removed with an adhesive surface.

17 . The method of claim 15 wherein said portions are removed with a pressurized gas.

18 . The method of claim 15 further comprising adjusting at least one of speed, pulses, and height to configure said ablation laser.