Circuit board embedded inductor
View Patent ↗A circuit board having an embedded inductor and a process for making the circuit board is provided. In general, the process begins by providing a core structure including a dielectric core layer and a first metal layer on a top surface of the dielectric core layer. The first metal layer is etched to form first inductor windings. A material, such as an epoxy material, including magnetic filler material is deposited over the first inductor windings. Thereafter, a prepreg layer is placed over and attached to the material deposited over the first inductor windings to form the circuit board having the embedded inductor.
1. A circuit board having an embedded inductor comprising:
a core structure comprising a dielectric core layer and a first metal layer on a top surface of the dielectric core layer, the first metal layer etched to form first inductor windings;
a material including a magnetic filler material deposited over the first inductor windings;
a first prepreg layer attached to a top surface of the material,
wherein the core structure further comprises a second metal layer on a bottom surface of the dielectric core layer, the second metal layer etched to form second inductor windings, the circuit board further comprising:
a material including magnetic filler material deposited over the second inductor windings; and
a second prepreg layer attached to a top surface of the material including the magnetic filler material deposited over the second inductor windings.
2. The circuit board of claim 1 further comprising a material including a magnetic filler material deposited over a bottom surface of the dielectric core layer to provide a magnetic path surrounding the first inductor windings.
3. The circuit board of claim 1 wherein the first inductor windings are electrically coupled to the second inductor windings such that the first and second inductor windings form an inductor.
4. The circuit board of claim 3 further comprising a via filled with electrically conductive material coupling an output of the first inductor windings to an input of the second inductor windings.
5. The circuit board of claim 3 wherein a spiral pattern of the second inductor windings is a continuation of a spiral pattern of the first inductor windings.
6. The circuit board of claim 1 , wherein the magnetic filler material encapsulates the first inductor windings.