IP Library Granted Patent US 7,413,109
Granted Patent B2
US 7,413,109 · App. 11/302,419 · Granted Aug 19, 2008

Joining of advanced materials by superplastic deformation

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Quick Facts
Patent No.
US 7,413,109
App. No.
11/302,419
Granted
Aug 19, 2008
Kind
B2
Abstract

A method for utilizing superplastic deformation with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The method does not require elaborate surface preparation or application techniques.

Claims (18)

1. A method for seamlessly joining together objects made of cermet, the method comprising:

a) selecting opposing surfaces of the objects having surface finishes as defined by root-mean-square values of up to 2 microns;

b) coating the surfaces with a fluid containing a metal;

c) decomposing the metal containing fluid so as to leave the metal on the surfaces; and

d) contacting the surfaces to each other for a time and at a temperature and pressure sufficient to form an irreversible bond between the objects.

2. The method as recited in claim 1 wherein the metal is identical to a metal contained in the objects.

3. The method as recited in claim 1 wherein the metal is Ti, or Co, or Fe, or Mn, or Zr, or Ti-alloy, or Co-alloy, or Fe-alloy, or Mn-alloy, or combinations thereof.

4. The method as recited in claim 2 wherein the fluid is a metal solution selected from the group consisting of metallic nitrates, metallic acetates, metallic hydroxides, metallic alkoxides, colloidal suspension of metals in solvents, or combinations thereof.

5. The method as recited in claim 1 wherein the residue has a thickness of five microns or less.

6. The method as recited in claim 1 wherein the fluid contains suspended hard particles, the particles selected from the group consisting of WC, TiC, TiN, or combinations thereof.

7. The method as recited in claim 6 wherein the suspended particles are less than or equal to 2 microns in diameter.

8. The method as recited in claim 1 wherein the residue has a thickness of less than or equal to 10 microns.

9. The method as recited in claim 1 wherein the objects undergoing seamless joining are allowed to deform during said joining process.

10. The method as recited in claim 1 wherein the decomposition step occurs in a reducing atmosphere.

11. The method as recited in claim 1 wherein the decomposition step occurs in an inert atmosphere.

12. The method as recited in claim 10 wherein the atmosphere contains hydrogen gas maintained at a temperature between 150-800° C.

13. The method as recited in claim 10 wherein the atmosphere contains hydrogen gas and argon.

14. The method as recited in claim 10 wherein the atmosphere is maintained at 150° C.

Assignments (3)
CONFIRMATORY LICENSE Recorded Apr 29, 2009
From: UCHICAGO ARGONNE, LLC
To: UNITED STATES DEPARTMENT OF ENERGY
Reel/Frame 022611/0640 →
CONFIRMATORY LICENSE Recorded Apr 29, 2009
From: UCHICAGO ARGONNE, LLC
To: UNITED STATES DEPARTMENT OF ENERGY
Reel/Frame 022611/0677 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2006
From: UNIVERSITY OF CHICAGO, THE
To: U CHICAGO ARGONNE LLC
Reel/Frame 018385/0618 →