MST device for attachment to an adhesive surface
View Patent ↗A micro-systems technology (MST) device for attachment to an adhesive surface. The MST device has an attachment surface for abutting the adhesive surfaces, a first fluid conduit connected to a first aperture in the attachment surface and, a recess in the attachment surface adjacent the first aperture to hold adhesive displaced from between the attachment surface and the adhesive surface when the MST device is attached such that displaced adhesive does not block fluid flow in the first conduit. By profiling the attachment surface so there is a recess next to the first aperture, there is less risk that adhesive will be squeezed into the conduit and impair fluid flow.
1. A micro-systems technology (MST) device for attachment to an adhesive surface, the MST device comprising:
an attachment surface for abutting the adhesive surface;
a plurality of first fluid conduits connected to an array of inlet apertures in the attachment surface; and,
an array of recesses interspersed with the array of inlet apertures to hold adhesive displaced from between the attachment surface and the adhesive surface when the MST device is attached such that displaced adhesive does not block fluid flow into the first fluid conduits.
2. A micro-systems technology (MST) device according to claim 1 wherein the array of inlet apertures is series of open channels in the attachment surface.
3. A micro-systems technology (MST) device according to claim 2 wherein the array of recesses is an arrangement of pits in the attachment surface.
4. A micro-systems technology (MST) device according to claim 3 wherein the channels are more than 50 microns wide and each separated by more than 50 microns of the attachment face.
5. A micro-systems technology (MST) device according to claim 4 wherein the channels are about 80 microns wide and separated by about 80 microns of attachment surface.
6. A micro-systems technology (MST) device according to claim 5 wherein the pits are more than 5 microns wide and more than 5 microns deep.
7. A micro-systems technology (MST) device according to claim 6 wherein the adhesive is a thermosetting adhesive that cures at a predetermined temperature.
8. micro-systems technology (MST) device according to claim 7 wherein the thermosetting adhesive has a maximum curing temperature of 150 degrees Celsius.
9. A micro-systems technology (MST) device according to claim 8 wherein the thermosetting adhesive is more than 12 microns thick.
10. A micro-systems technology (MST) device according to claim 1 wherein the MST device is a printhead IC and the adhesive surface is on a liquid crystal polymer (LCP) moulding which acts as a support structure for mounting the printhead IC within an inkjet printer.