IP Library › Granted Patent US 7,557,145
Granted Patent B2
US 7,557,145 · App. 11/305,380 · Granted Jul 7, 2009

Inhibition of the asexual reproduction of fungi by eugenol and/or derivatives thereof

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Quick Facts
Patent No.
US 7,557,145
App. No.
11/305,380
Granted
Jul 7, 2009
Kind
B2
Abstract

This invention relates to the use of eugenol and/or eugenol derivatives for inhibiting the asexual propagation of fungi. This invention also relates to filter media, adhesives, building materials, building auxiliaries, textiles, pelts, paper, skins or leather, laundry detergents, cleaning compositions, rinse agents, hand washing preparations, manual dishwashing detergents, machine dishwashing detergents and preparations for finishing building materials, building auxiliaries, textiles, pelts, paper, skins or leather that contain eugenol and/or eugenol derivatives and to preparations for treating building materials, building auxiliaries, textiles, pelts, paper, skins or leather that contain eugenol and/or eugenol derivatives.

Claims (14)

1. An adhesive comprising at least one of eugenol and one or more derivatives thereof, wherein the concentration of the eugenol and/or each of the one or more derivatives thereof in the adhesive is 0.000001% to 0.001% by weight.

2. The adhesive of claim 1 wherein the adhesive is water-based.

3. The adhesive of claim 1 wherein the adhesive is an adhesive for hanging wallpaper and wall covering materials.

4. A sealing compound comprising at least one of eugenol and one or more derivatives thereof, wherein the concentration of the eugenol and/or each of the one or more derivatives thereof in the sealing compound is 0.000001% to 0.001% by weight.

5. The sealing compound of claim 4 wherein the sealing compound is a jointing compound.

6. The adhesive of claim 1 wherein the concentration of each of the eugenol and/or the one or more derivatives thereof in the adhesive is 0.00001% to 0.0001% by weight.

7. The adhesive of claim 1 wherein the concentration of each of the eugenol and/or the one or more derivatives thereof in the adhesive is 0.0001% to 0.001% by weight.

8. The adhesive of claim 3 comprising an aqueous solution of a hydrocolloid.

9. The adhesive of claim 8 wherein the hydrocolloid is methylcellulose, methylhydroxypropyl cellulose, a water-soluble starch derivative, or polyvinyl acetate.

10. The sealing compound of claim 4 wherein the concentration of each of the eugenol and/or the one or more derivatives thereof in the sealing compound is 0.00001% to 0.0001% by weight.

11. The sealing compound of claim 4 wherein the concentration of each of the eugenol and/or the one or more derivatives thereof in the sealing compound is 0.0001% to 0.001% weight.

12. The sealing compound of claim 4 comprising a silicone, a urethane, or an acrylate.

13. The sealing compound of claim 4 comprising an aqueous solvent or an organic solvent.

14. The sealing compound of claim 4 comprising a rubber-like polymer.