Method and apparatus for cooling electronic enclosures
View Patent ↗An enclosure containing heat-producing equipment includes an air inlet for admitting air from an environment containing the enclosure. The equipment is situated relative to the air inlet such that the air absorbs heat from the equipment, increasing the temperature of the air. An air-to-liquid heat exchanger is mounted on an outside surface of the enclosure adjacent to an air outlet. The heat exchanger is connectable to an external cooling source such that heat from the heated air exiting the enclosure absorbed by the heat exchanger is expelled outside the environment containing the enclosure.
1. An enclosure containing heat-producing equipment, comprising:
an air inlet for admitting ambient air from an environment containing the enclosure, the air from the environment being at an ambient temperature, the equipment being situated relative to the air inlet such that the air absorbs heat from the equipment, thereby increasing the temperature of the air to a second temperature;
an air outlet for expelling the air heated to the second temperature from the enclosure;
an air-to-liquid heat exchanger mounted on an outside surface of the enclosure adjacent to the air outlet, the heat exchanger connected to an external cooling source and configured such that heat added by the equipment to the air exiting the enclosure is absorbed by the heat exchanger and is expelled outside the environment containing the enclosure and lowers the temperature of the air to the ambient temperature;
a modulating valve for regulating cooling liquid flow through the heat exchanger; and
a temperature sensor for sensing temperature of the air and a temperature controller for modulating the valve in response to the temperature of the air.
2. The enclosure of claim 1 , further comprising a fan disposed to force air through the heat exchanger.
3. The enclosure of claim 2 , wherein the fan is selected from the group consisting of a centrifugal blower, a cross-flow blower, an axial fan and a plug fan.
4. A cooling system for an enclosure containing heat-producing equipment, comprising:
an air inlet defined by the enclosure for admitting ambient air at an ambient temperature from an environment containing the enclosure, the air absorbing heat from the equipment;
an air outlet defined by the enclosure for expelling the heated air from the enclosure;
a first heat exchanger configured to have a cooling liquid flowing therein, the first heat exchanger being attached to an outside of the enclosure proximate the air outlet and configured to remove heat added by the equipment from the air expelled from the enclosure with the cooling liquid to cool the heated air exiting from the first heat exchanger to the ambient temperature;
a second heat exchanger located outside the environment containing the enclosure, the second heat exchanger receiving the cooling liquid from the first heat exchanger such that heat absorbed from the equipment is expelled outside the environment containing the enclosure;
a modulating valve for regulating cooling liquid flow through the first heat exchanger; and
a temperature sensor for sensing temperature of the air and a temperature controller for modulating the valve in response to the temperature of the air.
5. The cooling system of claim 4 , further comprising a fan for moving the air through the first heat exchanger.
6. A method for cooling an enclosure containing heat-generating equipment, the method comprising:
drawing ambient air into the enclosure at a first temperature from an environment containing the enclosure;
passing the air in the vicinity of the heat-generating equipment to absorb heat from the equipment, thus increasing the temperature of the air to a second temperature;
passing the air heated to the second temperature through an air-to-liquid heat exchanger mounted outside of and on the enclosure, and configured to transfer heat added by the equipment to the air exiting the enclosure to a cooling liquid;
returning the air to the environment containing the enclosure after the cooling liquid has absorbed heat therefrom to return the air to the first temperature level;
rejecting heat from the cooling liquid outside the environment containing the enclosure; and
modulating the cooling liquid flow through the heat exchanger so as to regulate the temperature of the air returned to the environment.
7. A method for cooling an enclosure containing heat-generating equipment, the method comprising:
drawing ambient air at an ambient temperature into the enclosure from an environment containing the enclosure;
passing the air in the vicinity of the heat-generating equipment to absorb heat from the equipment;
passing the heated air through an air-to-liquid heat exchanger mounted outside of and on the enclosure and configured to transfer heat added to the air by the equipment to a cooling liquid;
returning the air to the environment containing the enclosure after the cooling liquid has absorbed heat from the air to cool the air down to the ambient temperature;
flowing the cooling liquid to an external cooling source located outside the environment containing the enclosure so that the absorbed heat is expelled outside the environment containing the enclosure; and
modulating cooling liquid flow through the heat exchanger so as to regulate the temperature of the air returned to the environment.
8. A cooling system for an enclosure containing heat-producing equipment, comprising:
an air inlet for admitting ambient air from an environment containing the enclosure, the air from the environment being at a first temperature, the equipment being situated relative to the air inlet such that the air absorbs heat from the equipment thereby increasing the temperature of the air to a second temperature;
an air-to-liquid heat exchanger mounted on an outside surface of the enclosure such as to contact the air heated to the second temperature and configured to return the air to the first temperature, the heat exchanger connected to an external cooling source such that heat absorbed by the heat exchanger is expelled outside the environment containing the enclosure;
a modulating valve for regulating cooling liquid flow through the heat exchanger; and
a temperature sensor for sensing temperature of the air and a temperature controller for modulating the valve in response to the temperature of the air.
9. A method for cooling an enclosure containing heat-generating equipment, the method comprising:
drawing ambient air at a first temperature into the enclosure from an environment containing the enclosure;
passing the air in the vicinity of the heat-generating equipment to absorb heat from the equipment, thus increasing the temperature of the air to a second temperature;
passing the air heated to the second temperature through an air-to-liquid heat exchanger mounted on and outside of the enclosure and configured to reduce the temperature of the air to the first temperature by transferring heat to a cooling liquid;
allowing the air to return to the environment containing the enclosure after the cooling liquid has absorbed heat from the air;
flowing the cooling liquid to an external cooling source located outside the environment containing the enclosure so that the absorbed heat is expelled outside the environment containing the enclosure; and
modulating the cooling liquid flow through the heat exchanger so as to regulate the temperature of the air returned to the environment.