Interconnect including a pliable surface and use thereof

1. An interconnect, comprising:

a pliable surface having a plurality of nanostructures disposed thereon, a surface contacting at least a portion of the plurality of nanostructures, wherein the pliable surface is configured to allow the plurality of nanostructures to at least partially conform to the surface.

2. The interconnect as recited in claim 1 wherein the pliable surface is a substrate having portions etched there from to provide increased flexibility.

3. The interconnect as recited in claim 2 wherein the etched portions are located on an opposing side of the pliable surface as the nanostructures.

4. The interconnect as recited in claim 2 wherein the etched portions are located on a same side of the pliable surface as the nanostructures, the etched portions positioned between the nanostructures.

5. The interconnect as recited in claim 1 wherein the pliable surface is coupled to and at least partially suspended over a substrate.

6. The interconnect as recited in claim 1 wherein the pliable surface comprises a polymer.

7. The interconnect as recited in claim 1 wherein a conductive connection exists between the nanostructures and the surface.

8. The interconnect as recited in claim 7 wherein the conductive connection is thermal, electrical or both thermal and electrical.

9. The interconnect as recited in claim 1 wherein the plurality of nanostructures are a first plurality of nanostructures disposed on a side of the pliable surface, and further including a second plurality of nanostructures disposed on an opposing side of the pliable surface.

10. The interconnect as recited in claim 9 wherein the surface is a first surface and further including a second surface, and wherein the pliable surface is configured to allow the first plurality of nanostructures to at least partially conform to the first surface and the second plurality of nanostructures to at least partially conform to the second surface.

11. The interconnect as recited in claim 10 wherein attractive forces help at least a portion of the first plurality of nanostructures adhere to the first surface and at least a portion of the second plurality of nanostructures adhere to the second surface, the first and second surfaces being coupled to one another.

12. The interconnect as recited in claim 1 wherein attractive forces help at least a portion of the plurality of nanostructures adhere to the surface.

13. The interconnect as recited in claim 12 wherein the plurality of nanostructures are a first plurality of nanostructures and the surface is a second plurality of nanostructures.

14. The interconnect as recited in claim 12 wherein the attractive forces are selected from the group consisting of:

intermolecular forces;

Van Der Waals forces; and

dipole-dipole forces.

15. The interconnect as recited in claim 1 wherein the surface is a rough surface having a degree of surface roughness, and the pliable surface is configured to allow the plurality of nanostructures to at least partially conform to the rough surface.

16. A method for interconnecting multiple surfaces, comprising:

contacting a plurality of nanostructures disposed on a pliable surface with a surface, wherein the pliable surface is configured to allow the plurality of nanostructures to at least partially conform to the surface.

17. The method as recited in claim 16 wherein attractive forces help at least a portion of the plurality of nanostructures adhere to the surface.

18. The method as recited in claim 16 wherein a conductive connection exists between the nanostructures and the surface.

19. The method as recited in claim 18 wherein the conductive connection is thermal, electrical or both thermal and electrical.

20. The method as recited in claim 16 wherein the surface is a rough surface having a degree of surface roughness, and the pliable surface is configured to allow the plurality of nanostructures to at least partially conform to the rough surface.