IP Library Granted Patent US 7,790,089
Granted Patent B2
US 7,790,089 · App. 11/312,885 · Granted Sep 7, 2010

Process and mold for molding and coating a substrate

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Quick Facts
Patent No.
US 7,790,089
App. No.
11/312,885
Granted
Sep 7, 2010
Kind
B2
Abstract

A process for in-mold coating and a mold is disclosed. The process entails (i) obtaining a mold having at least two cavities, (ii) molding a thermoplastic substrate in a first cavity, (iii) introducing the substrate into a second cavity, and (iv) coating said substrate with lacquer, the coating being carried out under enhanced pressure.

Claims (15)

1. A process for in-mold coating comprising (i) obtaining a mold having at least two cavities, (ii) molding a thermoplastic substrate in a first cavity, (iii) introducing the substrate into a second cavity, (iv) coating said substrate with lacquer, the coating and subsequent curing of the lacquer being carried out under enhanced pressure, the pressure resulting from an injection pressure and a curing pressure, wherein the pressure during step (iv) is kept constant or is kept above a threshold pressure of 10 bar as the injection pressure decreases during curing, and the pressure in the cavity during step (iv) is adjusted and influenced in a controlled manner by thermal expansion of the substrate and of the lacquer.

2. Process according to claim 1 , characterized in that the coating with lacquer according to step (iv) is carried out by the reaction injection molding (RIM) process.

3. The process according to claim 1 wherein the molding is by injection molding, injection compression molding, compression, foaming or reaction injection molding.

4. The process according to claim 1 wherein the lacquer cures via free radicals, ionically or via polyaddition.

5. The process according to claim 1 wherein the lacquer contains not more than 10 wt. % solvent, the percent being relative to the weight of the lacquer.

6. The process according to claim 1 wherein the lacquer contains not more than 2 wt. % solvent, the percent being relative to the weight of the lacquer.

7. The process according to claim 1 wherein the lacquer contains not more than 1 wt. % solvent, the percent being relative to the weight of the lacquer.

8. The process according to claim 1 wherein the lacquer is solvent free.

9. The process according to claim 1 wherein the lacquer is a one-component or two-component lacquer.

10. The process according to claim 1 wherein the lacquer is a polyurethane system or a polyurea system.

11. The process according to claim 1 wherein the lacquer is a solvent-free aliphatic polyurethane system.

12. The process according to claim 1 wherein the lacquer has a pot life of not more than 30 min.

13. The process according to claim 1 wherein the lacquer has a pot life of not more than 10 min.

14. The process according to claim 1 wherein the lacquer has a pot life of not more than 2 min.

15. The process according to claim 1 wherein the pressure during coating according to step (iv) is in the range of from 10 to 90 bar (10.000 to 90.000 hPa).

Assignments (2)
CHANGE OF NAME Recorded Apr 5, 2016
From: BAYER MATERIALSCIENCE AG
To: COVESTRO DEUTSCHLAND AG
Reel/Frame 038353/0325 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2006
From: ZOLLNER, OLAF; JUST, THORSTEN; TILLACK, JORG; HAUSSTATTER, BERND; GLAWE, MICHAEL; KONEJUNG, KLAUS; LANG, STEFFEN
To: BAYER MATERIALSCIENCE AG
Reel/Frame 017767/0312 →