Liquid crystal display and fabricating method thereof
View Patent ↗Disclosed are a liquid crystal display and a fabricating method thereof enabling to improve an opening ratio of the liquid crystal display by modifying a structure of a thin film transistor. Each pixel of the liquid crystal display includes a gate line formed on a substrate in one direction with a predetermined interval from another one, a data line formed in a direction perpendicular to the gate line so as to define a pixel area, a thin film transistor formed on the gate line at an intersection between the gate and data lines, and a pixel electrode formed in the pixel area.
1. A method of fabricating a liquid crystal display, comprising:
forming a gate line on a substrate;
depositing a gate insulating layer on an entire surface of the substrate having the gate line formed thereon;
forming an island-like semiconductor layer on the gate insulating layer over the gate line; and
forming a data line on the gate insulating layer in a direction perpendicular to the gate line so as to be overlapped with one side of the semiconductor layer, wherein the data line includes a source electrode and the source electrode does not protrude from the data line;
forming a drain electrode over the gate line so as to be overlapped at an opposing side of the semiconductor layer as the data line, the drain electrode entirely contained within a boundary defined by the gate line; and
forming a passivation layer on an entire surface of the substrate and removing a contact portion of the passivation layer so as to have a contact hole exposing the drain electrode; and
forming a pixel electrode in a pixel area so as to be connected to the drain electrode through the contact hole, wherein the contact hole is formed within the gate line.
2. The method of claim 1 , wherein a gate electrode of a thin film transistor is contained within a boundary defined by the gate line, and a portion of the gate line where the thin film transistor is disposed is wider than a remaining portion of the gate line.
3. The method of claim 1 , further comprising forming the semiconductor layer over the gate line where a thin film transistor is to be formed as well as on the gate insulating layer where the data line is to be formed.
4. The method of claim 1 , wherein the gate line has at least one extension adjacent to an area of the gate line that overlaps the semiconductor layer such that the extensions are disposed on opposite sides of the gate line when multiple extensions are present, and a width of each extension is substantially smaller than a width of the gate line in which no extension is present.
5. The method of claim 1 , wherein the gate line has symmetrical extensions in an area that overlaps the semiconductor layer.
6. The method of claim 5 , wherein the extensions terminate at the intersection of the gate and data lines.
7. The method of claim 5 , wherein at least one of the extensions terminates at an intersection of the gate and data lines.
8. The method of claim 1 , wherein the semiconductor layer extends from an intersection of the gate and data lines along the second direction and is completely overlapped by the data line.
9. The method of claim 8 , wherein the gate line extends in a first direction, the data line extends in a second direction, and the semiconductor layer extends from the intersection in the second direction farther than from the intersection in the first direction.
10. The method of claim 6 , wherein the semiconductor layer is disposed entirely within the boundaries of the gate line.
11. A method of fabricating a liquid crystal display, comprising:
forming a gate line on a substrate having a widened portion;
depositing a gate insulating layer on an entire surface of the substrate having the gate line formed thereon;
forming an island-like semiconductor layer on the gate insulating layer within boundaries defined by the widened portion of the gate line;
forming a data line on the gate insulating layer in a direction perpendicular to the gate line so as to overlap a first side of the semiconductor layer without requiring a projection thereto, wherein the data line includes a source electrode and the source electrode does not protrude from the data line;
forming a drain electrode over the widened portion of the gate line so as to overlap the semiconductor layer at a second side thereof directly opposite to the first side, the drain electrode entirely contained within a boundary defined by the widened portion of the gate line; and
forming a passivation layer on an entire surface of the substrate and removing a contact portion of the passivation layer so as to have a contact hole exposing the drain electrode; and
forming a pixel electrode in a pixel area so as to be connected to the drain electrode through the contact hole, wherein the contact hole is formed within the gate line.