Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits

1. A computer system, comprising:

a circuit board;

a plurality of integrated circuits disposed on the circuit board;

an array of magnets operatively disposed on the circuit board; and

a plurality of pipes operatively connected between the plurality of integrated circuits and the array of magnets,

wherein fluid flow in at least one of the plurality of pipes is dependent on at least one magnetic field generated by the array of magnets

wherein the at least one magnetic field is generated across first and second segments of the at least one pair of the pipes,

wherein the segments are formed of an electrically non-conductive material, and

wherein a fluid flow direction in the first segment is opposite to that in the second segment.

2. The computer system of claim 1 , further comprising:

a heat exchanger disposed on the circuit board and operatively connected to the array of magnets.

3. The computer system of claim 1 , further comprising:

a ferromagnetic metal piece arranged to at least partially shield at least one magnetic field generated by the array of magnets.

4. The computer system of claim 1 , further comprising

a first electrical conductor attached to a portion of the segment; and

a second electrical conductor attached to another portion of the segment,

wherein fluid flow within the segment is dependent on an electrical current induced between the first electrical conductor and the second electrical conductor.

5. The computer system of claim 1 , wherein the electrically non-conductive material is plastic.

6. The computer system of claim 1 , wherein the fluid flow is dependent on an electrical current induced across a portion of the at least one of the plurality of pipes.

7. The computer system of claim 6 , further comprising:

a temperature sensor arranged to measure a temperature at a location of one of the plurality of integrated circuits, wherein the induced electrical current is dependent on the temperature sensor.

8. The computer system of claim 1 , wherein fluid flow in each of the plurality of pipes is individually controllable.

9. The computer system of claim 1 , wherein the fluid is at least one of thermally and electrically conductive.

10. The computer system of claim 1 , wherein at least one of the plurality of pipes is arranged to carry fluid away from at least one of the integrated circuits dependent on the array of magnets, and wherein at least one other of the plurality of pipes is arranged to carry fluid toward the at least one of the integrated circuits dependent on the array of magnets.

11. A method of cooling a plurality of integrated circuits, comprising:

generating a plurality of magnetic fields using an array of magnets;

using a plurality of pipes to pass electrically and thermally conductive fluid across the plurality of magnetic fields; and

propagating the fluid using the plurality of pipes toward the plurality of integrated circuits dependent on the plurality of magnetic fields

wherein the at least one magnetic field is generated across first and second segments of the at least one pair of the pipes,

wherein the segments are formed of an electrically non-conductive material, and

wherein a fluid flow direction in the first segment is opposite to that in the second segment.

12. The method of claim 11 , further comprising: at least partially shielding the plurality of magnetic fields.

13. The method of claim 11 , further comprising: measuring a temperature at a location of one of the plurality of integrated circuits; and adjusting the propagating dependent on the measuring.

14. The method of claim 11 , further comprising:

inducing electrical currents across the plurality of magnetic fields, wherein the propagating is dependent on the electrical currents.

15. A cooling apparatus, comprising:

a plurality of magnets housed in a ferromagnetic metal piece;

a plurality of pipes operatively connected to the ferromagnetic metal piece,

wherein the plurality of pipes are operatively connected to a plurality of integrated circuits;

a heat exchanger arranged to dissipate heat from fluid carried in the plurality of pipes,

wherein flow of the fluid in the plurality of pipes is dependent on a plurality of magnetic fields generated by the plurality of magnets

wherein the at least one magnetic field is generated across first and second segments of the at least one pair of the pipes,

wherein the segments are formed of an electrically non-conductive material, and

wherein a fluid flow direction in the first segment is opposite to that in the second segment.

16. The cooling apparatus of claim 15 , wherein the flow of fluid is dependent on an electrical current induced across one of the plurality of magnetic fields.

17. The cooling apparatus of claim 15 , wherein the ferromagnetic metal piece is arranged to at least partially shield the plurality of magnetic fields.

18. The cooling apparatus of claim 15 , wherein the flow of fluid is dependent on a temperature at a location of at least one of the plurality of integrated circuits.

19. The cooling apparatus of claim 15 , wherein the flow of fluid in each of the plurality of pipes is individually controllable.