IP Library Granted Patent US 7,564,629
Granted Patent B1
US 7,564,629 · App. 11/313,976 · Granted Jul 21, 2009

Microlens alignment procedures in CMOS image sensor design

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Quick Facts
Patent No.
US 7,564,629
App. No.
11/313,976
Granted
Jul 21, 2009
Kind
B1
Abstract

A method for aligning a microlens array in a sensor die to resolve non-symmetric brightness distribution and color balance of the image captured by the sensor die. The method includes performing a pre-simulation to simulate a microlens array alignment in a silicon die and to determine a shrink-factor and de-centering values, calculating the error in a real product's alignment in process and image offset, performing a post simulation based on offset calculation on the real product and re-design of the microlens alignment, and repeating the steps of calculating the error and performing the post-simulation until a satisfactory brightness distribution is obtained. The sensor die has sensor pixels, each pixel comprising a photodiode and a microlens for directing incoming light rays to the photodiode, wherein optical axis of the microlens is shifted with respect to optical axis of the photodiode by a preset amount determined by at least one iteration of alignment process.

Claims (44)

1. A method for aligning a microlens array in a sensor die, comprising:

(a) performing a pre-simulation to simulate a microlens array alignment in a silicon die and to determine a shrink-factor;

(b) designing a new photo-mask for the microlens array based on the shrink-factor;

(c) producing a sample silicon die using the new photo-mask;

(d) capturing an image of a collimated white light source using the sample silicon die;

(e) evaluating uniformity of brightness distribution of the image; and

in case of unsatisfactory brightness distribution;

(f) calculating error in alignment of the sample silicon die and a de-centering value;

(g) performing a post-simulation based on the error to tune the shrink-factor and the de-centering value;

(h) designing a new photo-mask for the microlens array based on the shrink-factor and the de-centering value; and

(i) repeating the steps (c)-(h) until a satisfactory brightness distribution is obtained.

2. The method of claim 1 , wherein the step of performing a pre-simulation includes the step of:

calculating an optimum offset for an optical axis of each element of the microlens array with respect to a corresponding photodiode of the silicon die.

3. The method of claim 2 , wherein the step of calculating optimum offset includes:

simulating a plurality of ray acceptance angles utilizing an optical ray trace technique.

4. The method of claim 1 , wherein the step of performing a post-simulation includes the step of:

calculating an optimum offset for an optical axis of each element of the microlens array with respect to a corresponding photodiode of the silicon die.

5. The method of claim 4 , wherein the step of calculating optimum offset includes:

simulating a plurality of ray acceptance angles utilizing an optical ray trace technique.

6. The method of claim 4 , wherein the step of evaluating uniformity of brightness distribution includes the steps of:

checking an intensity distribution of the image; and

checking a color balance of the image.

7. A computer readable medium carrying one or more sequences of instructions for aligning a microlens array in a sensor die, wherein execution of one or more sequences of instructions by one or more processors causes the one or more processors to perform the steps of:

(a) performing a pre-simulation to simulate a microlens array alignment in a silicon die and to determine a shrink-factor;

(b) designing a new photo-mask for the microlens array based on the shrink-factor;

(c) producing a sample silicon die using the new photo-mask;

(d) capturing an image of a collimated white light source using the sample silicon die;

(e) evaluating uniformity of brightness distribution of the image; and

in case of unsatisfactory brightness distribution;

(f) calculating error in alignment of the sample silicon die and an image de-centering value;

(g) performing a post-simulation based on the error to tune the shrink-factor;

(h) designing a new photo-mask for the microlens array based on the shrink-factor and the de-centering value; and

(i) repeating the steps (c)-(h) until a satisfactory brightness distribution is obtained.

8. A system for aligning a microlens array in a sensor die, comprising:

means for performing a pre-simulation to simulate a microlens array alignment in a silicon die and to determine a shrink-factor;

means for designing a new photo-mask for the microlens array based on the shrink-factor;

means for producing a sample silicon die using the new photo-mask;

means for capturing an image of a collimated white light source using the sample silicon die;

means for evaluating uniformity of brightness distribution of the image; and

in case of unsatisfactory brightness distribution;

means for calculating error in alignment of the sample silicon die and an image brightness center offset;

means for performing a post-simulation based on the error to tune the shrink-factor;

means for designing a new photo-mask for the microlens array based on the shrink-factor and the image brightness center offset; and

means for repeating the steps of producing a sample silicon die to the step of designing a new photo-mask until a satisfactory brightness distribution is obtained.

Assignments (7)
MERGER Recorded Jul 22, 2011
From: CROSSTEK CAPITAL, LLC
To: INTELLECTUAL VENTURES II LLC
Reel/Frame 026637/0632 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
NUNC PRO TUNC ASSIGNMENT Recorded May 27, 2009
From: MAGNACHIP SEMICONDUCTOR INC.
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 022732/0296 →
INTERSUBSIDIARY ASSET TRANSFER AGREEMENT Recorded Feb 28, 2007
From: MAGNACHIP SEMICONDUCTOR INC.
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 018943/0886 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2006
From: FENG, CHEN
To: IC MEDIA CORPORATION
Reel/Frame 018209/0937 →
MERGER Recorded Sep 6, 2006
From: I.C. MEDIA CORPORATION
To: MAGNACHIP SEMICONDUCTOR, INC.
Reel/Frame 018210/0180 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2005
From: FENG, CHEN
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 017402/0876 →