Method for manufacturing high-stability resistors, such as high ohmic poly resistors, integrated on a semiconductor substrate
View Patent ↗A method for protecting a circuit component on a semiconductor substrate from a plasma etching or other removal process includes forming a screening layer over an auxiliary layer to conceal at least an area of the auxiliary layer that overlays at least a portion of the circuit component, such as for example a high-ohmic poly resistor. The method transfers a pattern defined by a mask onto the screening layer by selectively removing portions of the screening layer in accordance with the pattern. Portions of the auxiliary layer that are not protected by the screening layer are removed using a plasma gas selective to the auxiliary layer material, without removing the area of the auxiliary layer that overlays the portion of the circuit component, thereby protecting the circuit component from the plasma gas via the screening layer and auxiliary layer.
1. A method for protecting a circuit component on a semiconductor substrate from a plasma etching or removal process, the method comprising:
forming an auxiliary layer over the circuit component to completely overlay and surround top and side surfaces of the circuit component;
forming a screening layer over the auxiliary layer to cover at least an area of the auxiliary layer that completely overlays and surrounds the top and side surfaces of the circuit component;
transferring a pattern defined by a mask onto the screening layer by selectively removing portions of the screening layer in accordance with the pattern, the remaining portions of the screening layer covering at least the area of the auxiliary layer that overlays the top and side surfaces of the circuit component; and
removing portions of the auxiliary layer that are not protected by the screening layer, using a plasma gas selective to the auxiliary layer material, without removing the area of the auxiliary layer that completely overlays and surrounds the top and side surfaces of the circuit component, thereby protecting the circuit component from the plasma gas via the screening layer and auxiliary layer.
2. The method of claim 1 , further comprising:
forming the circuit component on a first layer; wherein forming the auxiliary layer includes depositing the auxiliary layer over the circuit component formed on the first layer.
3. The method of claim 2 , wherein depositing the auxiliary layer includes depositing a tetraethylorthosilicate oxide (TEOS) layer.
4. The method of claim 2 , wherein depositing the auxiliary layer includes depositing a silicon nitride (SiN) layer over the tetraethylorthosilicate oxide (TEOS) layer to further stabilize electrical characteristics of the circuit component by serving as a baffler to hydrogen diffusion.
5. The method of claim 2 , wherein depositing the auxiliary layer includes depositing the auxiliary layer via Low Pressure Vapor Deposition (LPVD).
6. The method of claim 1 , wherein forming the screening layer includes depositing photosensitive material.
7. The method of claim 1 , wherein transferring the pattern defined by the mask onto the screening layer includes using a photolithographic process of exposing the defined pattern of the screening layer to ultraviolet light.
8. The method of claim 1 , wherein removing portions of the auxiliary layer includes using the plasma gas that is substantially selective to both SiN (Silicon Nitride) and tetraethylorthosilicate oxide (TEOS).
9. The method of claim 1 , further comprising:
removing the screening layer that protects the circuit component from the plasma gas.
10. The method of claim 9 , wherein removing the screening layer includes plasma ashing the screening layer.
11. The method of claim 9 , wherein removing the screening layer includes dry etching the screening layer.
12. The method of claim 9 , wherein removing the screening layer includes wet etching the screening layer.
13. The method of claim 1 , wherein forming the auxiliary layer over the top and side surfaces of the circuit component includes forming the auxiliary layer adjacent side surfaces of the circuit component that extend substantially perpendicular to the top surface.
14. The method of claim 1 , wherein the auxiliary layer includes a first portion to completely encapsulate the circuit component between the auxiliary layer and a surface carrying the circuit component and a second portion adjacent the first portion, wherein the pattern defined by the mask protects the first portion of the auxiliary layer from the plasma gas used to selectively remove the second portion of the auxiliary layer.
15. The method of claim 1 , further comprising:
forming a poly silicon layer overlying a first layer;
forming the circuit component from the poly silicon layer;
forming a gate electrode from the poly silicon layer adjacent the circuit component; and
forming the auxiliary layer over the gate electrode and the circuit component to overlay the top and side surface of the circuit component.
16. The method of claim 15 wherein the pattern defined by the mask onto the screening layer protects the area of the auxiliary layer that overlays the top and side surfaces of the circuit component and does not protect a second area of the auxiliary layer that overlays the gate electrode.
17. The method of claim 16 wherein removing portions of the auxiliary layer includes removing portions of the second area of the auxiliary layer that overlays the gate electrode, the remaining portions of the second area of the auxiliary layer forming sidewall spacers adjacent the gate electrode.
18. A method for protecting a circuit component on a semiconductor substrate from a plasma etching or removal process, the method comprising:
forming a first layer over the circuit component to completely overlay and surround top and side surfaces of the circuit component;
forming a second layer over the first layer to cover at least an area of the first layer that completely overlays and surrounds the top and side surfaces of the circuit component;
transferring a pattern defined by a mask onto the second layer by selectively removing portions of the second layer in accordance with the pattern, the remaining portions of the second layer covering at least the area of the first layer that overlays the top and side surfaces of the circuit component; and
removing portions of the first layer that are not protected by the second layer, using a plasma gas selective to the first layer material, without removing the area of the first layer that completely overlays and surrounds the top and side surfaces of the circuit component, thereby protecting the circuit component from the plasma gas via the second layer and first layer.
19. The method of claim 18 , wherein forming the first layer over the top and side surfaces of the circuit component includes forming the first layer to completely encapsulate the circuit component between the first layer and a third layer carrying the circuit component.
20. The method of claim 18 , wherein forming the first layer over the top and side surfaces of the circuit component includes forming the first layer adjacent the side surfaces of the circuit component that extend substantially perpendicular to the top surface.