IP Library Granted Patent US 7,422,994
Granted Patent B2
US 7,422,994 · App. 11/314,262 · Granted Sep 9, 2008

Platinum-copper-tungsten fuel cell catalyst

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Quick Facts
Patent No.
US 7,422,994
App. No.
11/314,262
Granted
Sep 9, 2008
Kind
B2
Abstract

A composition for use as a catalyst in, for example, a fuel cell, the composition comprising platinum, copper and tungsten, or an oxide, carbide and/or salt of one or more of platinum, copper and tungsten, wherein the sum of the concentrations of platinum, copper and tungsten, or an oxide, carbide and/or salt thereof, is greater than 90 atomic percent.

Claims (31)

1. A composition comprising platinum (as platinum metal, platinum oxide, platinum carbide and/or a platinum salt), copper (as copper metal, copper oxide, copper carbide and/or a copper salt) and tungsten (as at least tungsten oxide), wherein the sum of the concentrations of said platinum (as platinum metal, platinum oxide, platinum carbide and/or a platinum salt), said copper (as copper metal, copper oxide, copper carbide and/or a copper salt), and said tungsten (as at least tungsten oxide) is greater than 90 atomic percent.

2. The composition of claim 1 wherein said sum is greater than 92 atomic percent.

3. The composition of claim 1 wherein the concentration of said platinum (as platinum metal, platinum oxide, platinum carbide and/or platinum salt) is at least about 10 atomic percent and less than about 80 atomic percent.

4. The composition of claim 1 wherein the concentration of said tungsten (as at least tungsten oxide) is at least about 10 atomic percent and less than about 80 atomic percent.

5. The composition of claim 1 wherein the concentration of said copper (as copper metal, copper oxide, copper carbide and/or copper salt) is at least about 1 atomic percent and less than about 60 atomic percent.

6. The composition of claim 1 wherein (i) the sum of the concentrations of said platinum (as platinum metal, platinum oxide, platinum carbide and/or platinum salt), said copper (as copper metal, copper oxide, copper carbide and/or copper salt) and said tungsten (as at least tungsten oxide) is greater than 95 atomic percent, and (ii) the concentration of said platinum (as platinum metal, platinum oxide, platinum carbide and/or platinum salt) is greater than about 20 atomic percent and less than about 50 atomic percent.

7. The composition of claim 1 wherein (i) the sum of the concentrations of said platinum (as platinum metal, platinum oxide, platinum carbide and/or platinum salt), said copper (as copper metal, copper oxide, copper carbide and/or copper salt) and said tungsten (as at least tungsten oxide) is greater than 95 atomic percent, and (ii) the concentration of said tungsten (as at least said tungsten oxide) is greater than about 40 atomic percent and less than about 80 atomic percent.

8. The composition of claim 1 wherein (i) the sum of the concentrations of said platinum (as platinum metal, platinum oxide, platinum carbide and/or platinum salt), said copper (as copper metal, copper oxide, copper carbide and/or copper salt) and said tungsten (as at least tungsten oxide) is greater than 95 atomic percent, and (ii) the concentration of copper (as copper metal, copper oxide, copper carbide and/or copper salt) is greater than about 2 atomic percent and less than about 25 atomic percent.

9. The composition of claim 1 wherein the composition consists essentially of said platinum (as platinum metal, platinum oxide, platinum carbide and/or platinum salt), said copper (as copper metal, copper oxide, copper carbide and/or copper salt) and said tungsten (as at least tungsten oxide).

10. The composition of claim 1 wherein the concentration of said copper (as copper metal, copper oxide, copper carbide, and/or copper salt) is greater than about 1 atomic percent.

11. The composition of claim 1 wherein the concentration of said tungsten (as at least tungsten oxide) is greater than about 1 atomic percent.

12. The composition of claim 1 wherein the concentration of said platinum (as platinum metal, platinum oxide, platinum carbide, and/or platinum salt) is greater than about 1 atomic percent.

13. The composition of claim 1 , wherein the copper present therein has an average oxidation state of about zero.

14. A supported electrocatalyst powder for use in electrochemical reactor devices, the supported electrocatalyst powder comprising the composition of claim 1 on electrically conductive supports.

15. A composition comprising platinum (as platinum metal, platinum oxide, platinum carbide and/or a platinum salt), copper (as copper metal, copper oxide, copper carbide and/or a copper salt) and tungsten (as at least tungsten oxide), wherein the concentration of said tungsten (as at least tungsten oxide) is greater than 40 atomic percent.

16. The composition of claim 15 , wherein the copper present therein has an average oxidation state of about zero.

17. A supported electrocatalyst powder for use in electrochemical reactor devices, the supported electrocatalyst powder comprising the composition of claim 15 on electrically conductive supports.

18. A composition comprising platinum (as platinum metal, platinum oxide, platinum carbide and/or a platinum salt), copper (as copper metal, copper oxide, copper carbide and/or a copper salt) and tungsten (as at least tungsten oxide), wherein the concentration of said platinum (as platinum metal, platinum oxide, platinum carbide and/or platinum salt) is at least 30 atomic percent.

19. The composition of claim 18 , wherein the copper present therein has an average oxidation state of about zero.

20. A supported electrocatalyst powder for use in electrochemical reactor devices, the supported electrocatalyst powder comprising the composition of claim 18 on electrically conductive supports.

21. A composition comprising platinum (as platinum metal, platinum oxide, platinum carbide and/or a platinum salt), copper (as copper metal, copper oxide, copper carbide and/or a copper salt) and tungsten (as at least tungsten oxide), wherein the concentration of said copper (as copper metal, copper oxide, copper carbide and/or copper) is less than 20 atomic percent.

22. The composition of claim 21 , wherein the copper present therein has an average oxidation state of about zero.

23. A supported electrocatalyst powder for use in electrochemical reactor devices, the supported electrocatalyst powder comprising the composition of claim 21 on electrically conductive supports.

24. A composition comprising platinum (as platinum metal, platinum oxide, platinum carbide and/or a platinum salt), copper (as copper metal, copper oxide, copper carbide and/or a copper salt) and tungsten (as at least tungsten oxide), wherein said composition has a body-centered cubic lattice structure.

25. The composition of claim 24 wherein the concentration of said tungsten (as at least tungsten oxide) exceeds the sum of the concentrations of said platinum (as platinum metal, platinum oxide, platinum carbide, and/or platinum salt) and said copper (as copper metal, copper oxide, copper carbide, and/or copper salt).

26. The composition of claim 24 , wherein the copper present therein has an average oxidation state of about zero.

27. A supported electrocatalyst powder for use in electrochemical reactor devices, the supported electrocatalyst powder comprising the composition of claim 24 on electrically conductive supports.

28. A composition comprising platinum (as platinum metal, platinum oxide, platinum carbide and/or a platinum salt), copper (as copper metal, copper oxide, copper carbide and/or a copper salt) and tungsten (as at least tungsten oxide), wherein the composition has a face-centered-cubic lattice structure.

29. The composition of claim 28 wherein the concentration of said tungsten (as at least tungsten oxide) exceeds the sum of the concentrations of said platinum (as platinum metal, platinum oxide, platinum carbide, and/or platinum salt) and said copper (as copper metal, copper oxide, copper carbide, and/or copper salt).

30. The composition of claim 28 , wherein the copper present therein has an average oxidation state of about zero.

31. A supported electrocatalyst powder for use in electrochemical reactor devices, the supported electrocatalyst powder comprising the composition of claim 28 on electrically conductive supports.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2010
From: SYMYX SOLUTIONS, INC.
To: FREESLATE, INC.
Reel/Frame 024057/0911 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2009
From: SYMYX TECHNOLOGIES, INC.
To: SYMYX SOLUTIONS, INC.
Reel/Frame 022939/0564 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2006
From: CHONDROUDIS, KONSTANTINOS; GORER, ALEXANDER; STRASSER, PETER; DEVENNEY, MARTIN; FAN, QUN; GIAQUINTA, DANIEL M.; CENDAK, KEITH JAMES; OYANAGI, HIROYUKI; URATA, KENTA
To: SYMYX TECHNOLOGIES, INC.; HONDA GIKEN KOGYO KABUSHIKI KAISHA
Reel/Frame 017827/0294 →