Laminating apparatus and method
A laminating apparatus for laminating a cover layer onto a disk substrate, including a pressure member for pressing a surface of the disk substrate opposite to a surface on which the cover layer will be laminated, wherein: the pressure member includes a first pressure portion for pressing an outer circumferential end portion of the disk substrate, and a second pressure portion for pressing an inner circumferential end portion of the disk substrate; and after the first pressure portion presses the outer circumferential end portion of the disk substrate, the second pressure portion presses the inner circumferential end portion of the disk substrate to thereby laminate the cover layer onto the disk substrate.
1 . A laminating apparatus for laminating a cover layer onto a disk substrate, comprising a pressure member for pressing a surface of the disk substrate opposite to a surface on which the cover layer is to be laminated, wherein:
the pressure member includes a first pressure portion for pressing an outer circumferential end portion of the disk substrate, and a second pressure portion for pressing an inner circumferential end portion of the disk substrate; and
after the first pressure portion presses the outer circumferential end portion of the disk substrate, the second pressure portion presses the inner circumferential end portion of the disk substrate to thereby laminate the cover layer onto the disk substrate.
2 . The laminating apparatus according to claim 1 , wherein the second pressure portion presses the inner circumferential end portion after the first pressure portion presses the outer circumferential end portion in a place at least 0.1 mm ahead from the second pressure portion.
3 . A laminating method for laminating a cover layer onto a disk substrate, comprising: operating a first pressure means to press an outer circumferential end portion of the disk substrate; and after the operating of the first pressure means, operating a second pressure means to press an inner circumferential end portion of the disk substrate so that a surface of the disk substrate opposite to a surface on which the cover layer is to be laminated is pressed to thereby laminate the cover layer onto the disk substrate.
4 . The lamination method according to claim 3 , wherein the second pressure means presses the inner circumferential end portion after the first pressure means presses the outer circumferential end portion in a place at least 0.1 mm ahead from the second pressure means.