IP Library Granted Patent US 7,406,228
Granted Patent B2
US 7,406,228 · App. 11/315,235 · Granted Jul 29, 2008

Backlight module structure for LED chip holder

Assignee: Chunghwa Picture Tubes, Ltd.
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Quick Facts
Patent No.
US 7,406,228
App. No.
11/315,235
Granted
Jul 29, 2008
Kind
B2
Abstract

The present invention provides a backlight module for a light emitting device (LED) chip holder. The backlight module includes a top guide-light board, a bottom guide-light board, a chip holder with an inclined plane thereon, and a light emitting diode chip. One side of the top guide-light board and the bottom guide-light board has a reflective sheet, and the light emitting diode chip is located on the inclined surface of the chip holder, and further the light emitting diode chip is embedded in the bottom guide-light. When the light emitting diode chip emits incident light, the light produces the total reflection on the bottom guide-light board to reflect to the reflective mirror. Then, the light is reflected to the top guide-light board by the reflective sheet, and is emitted out from the top guide-light board to be a light source for the backlight module.

Claims (25)

1. A light emitting diode chip backlight module, comprising:

a top guide-light board;

a bottom guide-light board located under said top guide-light board;

a chip holder having a flat plane and a inclined plane, wherein said flat plane is disposed under said bottom light-guide board to decrease the thickness of the backlight module, and said inclined plane bends toward an inclined side of said bottom guide-light board, having an angle between said flat plane and said inclined plane, said angle being larger than 90 degrees and less than 180 degrees;

a light emitting diode chip disposed on said bent plane; and

a reflective mirror located on the other side of said bottom guide-light board and a side of said top guide-light board, wherein said reflective mirror reflects light from said bottom guide-light board to said top guide-light board.

2. The light emitting diode chip backlight module according to claim 1 , wherein said top guide-light board comprises a plurality of marks therein.

3. The light emitting diode chip backlight module according to claim 1 , wherein said chip holder comprises a metal substrate.

4. The light emitting diode chip backlight module according to claim 1 , wherein said light emitting diode chip comprises a red, green, and blue (RGB) light emitting diode chip.

5. The light emitting diode chip backlight module according to claim 1 , wherein said light emitting diode chip comprises a white light emitting diode chip.

6. The light emitting diode chip backlight module according to claim 1 , further comprising a first reflective sheet, a second reflective sheet, and a third reflective sheet, said first reflective sheet located between said top guide-light board and said bottom guide-light board, said second reflective sheet located between said first reflective sheet and said bottom guide-light board, and said third reflective sheet located under said bottom guide-light board.

7. The light emitting diode chip backlight module according to claim 1 , further comprising an epoxy resin covering said light emitting diode chip.

8. The light emitting diode chip backlight module according to claim 1 , wherein said light emitting diode chip is embedded in said bottom guide-light board.

9. A light emitting diode chip backlight module, comprising:

a top guide-light board;

a bottom guide-light board having a cave therein, and said bottom guide-light board being located under said top guide-light board;

a chip holder located on a side of said cave of said bottom guide-light board, said chip holder having a flat plane and a inclined plane, wherein said flat plane is disposed under said bottom guide-light board to decrease the thickness of the backlight module, and said inclined plane bends toward said side of said cave of said bottom guide-light board, having an angle between said flat plane and said inclined plane, said angle being larger than 90 degrees and less than 180 degrees;

a light emitting diode chip disposed on said bent plane; and

a reflective mirror located on the other side of both said bottom guide-light board and one side of said top guide-light board, wherein said reflective mirror reflects light from said bottom guide-light board to said top guide-light board.

10. The light emitting diode chip backlight module according to claim 9 , wherein said top guide-light board comprises a plurality of marks therein.

11. The light emitting diode chip backlight module according to claim 1 , wherein said chip holder comprises a metal substrate.

12. The light emitting diode chip backlight module according to claim 9 , wherein said light emitting diode chip is embedded into said bottom guide-light board.

13. The light emitting diode chip backlight module according to claim 9 , further comprising a first reflective sheet, a second reflective sheet, and a third reflective sheet, said first reflective sheet located between said top guide-light board and said bottom guide-light board, said second reflective sheet located between said first reflective sheet and said bottom guide-light board, and said third reflective sheet located under said bottom guide-light board.

14. The light emitting diode chip backlight module according to claim 9 , wherein said light emitting diode chip comprises a red, green, and blue (RGB) light emitting diode chip.

15. The light emitting diode chip backlight module according to claim 9 , wherein said light emitting diode chip comprises a white light emitting diode chip.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2013
From: CHUNGHWA PICTURE TUBES, LTD.
To: CPT TECHNOLOGY (GROUP) CO., LTD.
Reel/Frame 030763/0316 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 23, 2005
From: TING, CHU-CHI; CHIU, TIEN-LUNG; TSENG, WEI-YANG; LO, WEI-YU
To: CHUNGHWA PICTURE TUBES, LTD
Reel/Frame 017407/0677 →
Priority Claims (1)
TW 94139829 A · Nov 11, 2005 · national
Continuity (1)
Related Publication 20070116424A1 · May 24, 2007