IP Library Granted Patent US 7,555,826
Granted Patent B2
US 7,555,826 · App. 11/315,504 · Granted Jul 7, 2009

Method of manufacturing RFID devices

Assignee: Avery Dennison Corporation
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Quick Facts
Patent No.
US 7,555,826
App. No.
11/315,504
Granted
Jul 7, 2009
Kind
B2
Abstract

A method of making RFID devices includes feeding in an interposer web or sheet at a variable (non-constant) speed, cutting single interposers from the interposer web or sheet, and using a rotary transport device to transport the singulated (cut) interposers to an antenna web. The interposers are transferred from the rotary transport device and are attached to the antenna web, being operatively coupled to antennas on the antenna web. The interposers each include an RFID transponder chip and conductive leads. A feeder is used to advance the interposer web or sheet into a cutting zone between the rotary cutter and the rotary transport device. The rotary cutting device may be capable of singulating multiple interposers at one time, and the system may be capable of thus being able to remove interposers that are not to be joined to the antenna web.

Claims (26)

1. A method of forming an RFID device, the method comprising:

feeding a free end of an interposer web into a cutter, wherein the feeding includes moving the free end with a non-constant speed:

butt cutting an interposer from the free end of the interposer web onto a rotary transport mechanism:

transporting the interposer on the rotary transport mechanism;

transferring the interposer from the rotary transport mechanism to a moving antenna web; and

attaching the interposer to the antenna web. such that the interposer is operatively coupled to an antenna of the antenna web,

wherein the butt cutting includes using a rotary cutter to butt cut the interposer onto an anvil of the rotary transport mechanism;

wherein the rotary cutter includes multiple blades configured for contacting different locations on the free end of the interposer web in a single cutting operation; and

wherein the butt cutting includes selectively using the multiple blades to butt cut additional material along with the interposer, wherein the interposer and the additional material are butt cut substantially simultaneously in the single cutting operation.

2. The method of claim 1 , further comprising removing the additional material.

3. The method of claim 2 , wherein the removing includes using suction to pull the additional material away from the cutter.

4. The method of claim 3 , wherein the using suction includes sucking the additional interposer into a chute.

5. The method of claim 1 , wherein the additional material includes an additional interposer.

6. The method of claim 5 , wherein the additional interposer is an interposer that has failed testing.

7. The method of claim 1 , wherein the rotary transport mechanism includes a vacuum holder to hold the interposer in place for the transporting.

8. The method of claim 1 , wherein the antenna web moves at a substantially constant speed substantially throughout the forming of the RFID article.

9. The method of claim 1 , wherein the feeding includes advancing the interposer web with a feeder.

10. The method of claim 9 , wherein the feeder also retracts the interposer web following the butt cutting.

11. The method of claim 1 ,

wherein the method is performed iteratively for multiple iterations; and

wherein the feeding includes different amounts of the free end in different iterations.

12. The method of claim 1 , wherein the interposer web has an interposer pitch in a down-web direction that is of higher density than an antenna pitch in a down-web direction of the antenna web.

13. The method of claim 1 , wherein the interposer web includes an interposer substrate, and plural combinations on the substrate of a transponder chip and conductive leads operatively coupled to the transponder chip.

14. The method of claim 13 , wherein the interposer includes the transponder chip, the conductive leads, and a portion of the interposer substrate.

15. The method of claim 14 , wherein the interposer substrate is a paper substrate.

16. The method of claim 14 , wherein the interposer substrate is a polymer substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2022
From: AVERY DENNISON CORPORATION
To: AVERY DENNISON RETAIL INFORMATION SERVICES LLC
Reel/Frame 059862/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2006
From: ARMIJO, EDWARD A.; HUGHEN, JOHN F.; KENNEDY, STEVEN C.; LINDER, SAMUEL A.; MUNN, JASON D.
To: AVERY DENNISON CORPORATION
Reel/Frame 017372/0317 →
Continuity (1)
Related Publication 20070144662A1 · Jun 28, 2007