Interconnect structure for transducer assembly

1. An interconnect assembly, comprising:

an interconnect structure comprising a plurality of interconnect layers disposed in a spaced relationship, wherein each of the plurality of interconnect layers comprises a plurality of conductive traces disposed thereon; and

a redistribution layer disposed proximate the interconnect structure, wherein the redistribution layer is configured to facilitate coupling the interconnect structure to the one or more transducer elements on a transducer array, the redistribution layer having a top side and a bottom side, the top side and the bottom side of the redistribution layer each having a plurality of coupling elements disposed thereon.

2. The assembly of claim 1 , wherein a number of the plurality of conductive traces disposed on each of the plurality of interconnect layers is inversely proportional to a number of interconnect layers in the interconnect structure.

3. The assembly of claim 1 , wherein a pitch of the coupling elements disposed on the top side of the redistribution layer is configured to facilitate coupling the redistribution layer to the one or more transducer elements on the transducer array and a pitch of the coupling elements disposed on the bottom side of the redistribution layer is configured to facilitate coupling the redistribution layer to the plurality of conductive traces on the plurality of interconnect layers in the interconnect structure.

4. The assembly of claim 1 , wherein the redistribution layer comprises a plurality of vias configured to facilitate operatively coupling the one or more coupling elements disposed on the top side of the redistribution layer to the one or more coupling elements disposed on the bottom side of the redistribution layer.

5. The assembly of claim 1 , wherein the redistribution layer is disposed directly on the interconnect structure.

6. A transducer assembly, comprising:

a transducer array comprising one or more transducer elements arranged in a spaced relationship; and

an interconnect structure comprising a plurality of interconnect layers disposed in a spaced relationship, wherein each of the plurality of interconnect layers comprises a plurality of conductive traces disposed thereon, and wherein a number of the plurality of conductive traces disposed on each of the plurality of interconnect layers is inversely proportional to a number of interconnect layers in the interconnect structure; and

a redistribution layer disposed proximate the interconnect structure, wherein the redistribution layer is configured to facilitate coupling the interconnect structure to the one or more transducer elements on the transducer array, the redistribution layer comprising a plurality of coupling elements disposed on a top side and a bottom side thereof.

7. The assembly of claim 6 , wherein a pitch of the coupling elements disposed on the top side of the redistribution layer is configured to facilitate coupling the redistribution layer to the one or more transducer elements on the transducer array and a pitch of the coupling elements disposed on the bottom side of the redistribution layer is configured to facilitate coupling the redistribution layer to the plurality of conductive traces on the plurality of interconnect layers in the interconnect structure.

8. The assembly of claim 6 , wherein the redistribution layer comprises a plurality of vias configured to facilitate electrical coupling of the one or more coupling elements disposed on the top side of the redistribution layer to the coupling elements disposed on the bottom side of the redistribution layer.

9. The assembly of claim 6 , wherein the one or more transducer elements in the transducer array are arranged in a spaced relationship to form a transducer array having a predetermined shape.

10. The assembly of claim 9 , wherein the predetermined shape of the transducer array comprises a square, a rectangle, a circle, a rhombus, a triangle, a hexagon, an octagon, or combinations thereof.

11. The assembly of claim 6 , wherein the transducer array comprises a piezoelectric array, a micromachined ultrasound array or combinations thereof.

12. The assembly of claim 6 , wherein the transducer assembly comprises one of a forward viewing transducer assembly for use in a forward viewing probe, a side viewing transducer assembly for use in a side viewing probe, or an oblique viewing transducer assembly for use in an oblique viewing probe.

13. A transducer assembly, comprising:

a transducer array comprising one or more transducer elements arranged in an ‘N×M’ grid, wherein N and M are integers;

an interconnect structure disposed proximate the transducer array and comprising ‘K’ interconnect layers disposed in a spaced relationship, wherein each of the ‘K’ interconnect layers comprises ‘L’ conductive traces disposed thereon, wherein ‘K’ is less than ‘M’ and ‘L’ is greater than ‘N’, and wherein ‘K’ and ‘L’ are integers; and

a redistribution layer disposed proximate the interconnect structure, wherein the redistribution layer is configured to facilitate coupling the interconnect structure to the one or more elements in the transducer array, the redistribution layer comprising a plurality of coupling elements disposed on a top side and a bottom side thereof, and wherein a pitch of the coupling elements disposed on the top side of the redistribution layer is configured to facilitate coupling the redistribution layer to the one or more transducer elements on the transducer array and a pitch of the coupling elements disposed on the bottom side of the redistribution layer is configured to facilitate coupling the redistribution layer to the plurality of interconnect layers in the interconnect structure.

14. The assembly of claim 13 , wherein the redistribution layer comprises a plurality of vias configured to facilitate electrical coupling of the coupling elements disposed on the top side of the redistribution layer to the coupling elements disposed on the bottom side of the redistribution layer.

15. A method for forming a transducer assembly, the method comprising:

providing a transducer array having one or more transducer elements arranged in a spaced relationship;

forming an interconnect structure by disposing a plurality of interconnect layers in a spaced relationship, wherein each of the plurality of interconnect layers comprises a plurality of conductive traces disposed thereon, and wherein a number of the plurality of conductive traces disposed on each of the plurality of interconnect layers is inversely proportional to a number of interconnect layers in the interconnect structure;

disposing a redistribution layer between the interconnect structure and the transducer array to facilitate coupling the transducer array to the interconnect structure, the disposing the redistribution layer comprising patterning a plurality of coupling elements on a top side and a bottom side of the redistribution layer; and

coupling the interconnect structure to the transducer array via the redistribution layer.

16. The method of claim 15 , wherein patterning the plurality of coupling elements comprises:

arranging the plurality of coupling elements on the top side of the redistribution layer such that a pitch of the coupling elements disposed on the top side is configured to facilitate coupling the redistribution layer to the one or more transducer elements in the transducer array; and

arranging the plurality of coupling elements on the bottom side of the redistribution layer such that a pitch of the coupling elements disposed on the bottom side is configured to facilitate coupling the redistribution layer to the plurality of interconnect layers in the interconnect structure.

17. The method of claim 16 , further comprising providing a plurality of vias on the redistribution layer to facilitate operatively coupling the coupling elements disposed on the top side of the redistribution layer to the coupling elements disposed on the bottom side of the redistribution layer.

18. The method of claim 15 , wherein disposing the redistribution layer comprises disposing the redistribution layer directly on the interconnect structure.

19. A system, comprising:

an acquisition subsystem configured to acquire image data, wherein the acquisition subsystem comprises a probe configured to image a region of interest, wherein the probe comprises at least one transducer assembly, and wherein the at least one transducer assembly comprises:

a transducer array comprising one or more transducer elements arranged in an ‘N×M’ grid, wherein N and M are integers;

an interconnect structure disposed proximate the transducer array and comprising ‘K’ interconnect layers disposed in a spaced relationship, wherein each of the ‘K’ interconnect layers comprises ‘L’ conductive traces disposed thereon, wherein ‘K’ is less than ‘M’ and ‘L’ is greater than ‘N’, and wherein ‘K’ and ‘L’ are integers;

a redistribution layer disposed proximate the interconnect structure, wherein the redistribution layer is configured to facilitate coupling the interconnect structure to the one or more transducer elements on the transducer array; and

a processing subsystem in operative association with the acquisition subsystem and configured to process the image data acquired via the acquisition subsystem.

20. The system of claim 19 , further comprising an operator console configured to facilitate a user to manipulate the acquired image data.

21. The system of claim 19 , wherein the processing subsystem comprises an imaging system, wherein the imaging system comprises an ultrasound imaging system, a magnetic resonance imaging system, an X-ray imaging system, a nuclear imaging system, a positron emission tomography system, or combinations thereof.

22. The system of claim 21 , wherein the imaging system comprises a display module configured to display the processed image data.