Head gimbal assembly provided with solder ball connecting structure allowing re-utilization of suspension
View Patent ↗Embodiments of the invention provide a head gimbal assembly (HGA) provided with a solder ball connecting structure suitable for the re-utilization of a suspension assembly. In one embodiment, the HGA includes lead wires provided at front ends thereof with lead pads and also includes slider pads capable of being connected to the lead pads by solder ball bonding with the use of solder balls. Respective grooves formed in the surfaces of the slider pads inhibit the solder balls from rotating and moving over the surfaces of the slider pads and the lead pads before the radiation of a laser beam.
1. A head gimbal assembly comprising:
a lead wire having a lead pad with a connection surface;
a head/slider having a slider pad configured to be soldered to said connection surface of said lead pad with use of a solder ball, a restraining portion being provided in said slider pad, said restraining portion comprising a groove formed in the surface of said slider pad, wherein said groove is wider at a position thereof close to an air bearing surface of said head/slider than at a position thereof close to a fixing surface of said head/slider, said restraining portion restraining rotation and movement of said solder ball while being supported by a surface of said slider pad and said connection surface of said lead pad;
a flexure configured to support said head/slider; and
a load beam configured to support said flexure,
wherein said connection surface is formed as a flat surface to allow removal of solder adhered thereto and reuse of the lead pad.
2. The head gimbal assembly according to claim 1 , wherein the width of said groove is not larger than the diameter of said solder ball.
3. The head gimbal assembly according to claim 2 , wherein the width of said groove is not smaller than two thirds of the diameter of the solder ball.
4. The head gimbal assembly according to claim 1 , wherein said groove comprises an aperture formed by half-etching said slider pad.
5. The head gimbal assembly according to claim 1 , wherein said slider pad is formed by gold plating.
6. The head gimbal assembly according to claim 1 , wherein said flexure, said load beam and said lead wire constitute a wiring integrated type suspension assembly.
7. The head gimbal assembly according to claim 1 , wherein a plane including a connection surface of said slider pad and a plane including a connection surface of said lead pad intersect each other at a right angle.
8. The head gimbal assembly according to claim 1 , wherein six said slider pads are formed on said head/slider.
9. A magnetic disk drive comprising:
a magnetic disk;
a head gimbal assembly on which a head/slider is mounted, said head/slider being adapted to access said magnetic disk; and
an actuator assembly configured to pivotally move said head gimbal assembly;
wherein said head gimbal assembly comprises:
a lead wire having a lead pad with a connection surface;
a head/slider having a slider pad configured to be soldered to said connection surface of said lead pad with use of a solder ball, a restraining portion being provided in said slider pad, said restraining portion comprising a groove formed in the surface of said slider pad wherein said groove is wider at a position thereof close to an air bearing surface of said head/slider than at a position thereof close to a fixing surface of said head/slider, said restraining portion restraining rotation and movement of said solder ball while being supported by a surface of said slider pad and said connection surface of said lead pad;
a flexure configured to support said head/slider; and
a load beam configured to support said flexure,
wherein said connection surface is formed as a flat surface to allow removal of solder adhered thereto and reuse of the lead pad.
10. The magnetic disk drive according to claim 9 , wherein the width of said groove is not larger than the diameter of said solder ball.
11. The magnetic disk drive according to claim 10 , wherein the width of said groove is not smaller than two thirds of the diameter of the solder ball.
12. The magnetic disk drive according to claim 9 , wherein said groove comprises an aperture formed by half-etching said slider pad.