IP Library Granted Patent US 7,486,006
Granted Patent B2
US 7,486,006 · App. 11/318,342 · Granted Feb 3, 2009

Piezoelectric resonator having improved temperature compensation and method for manufacturing same

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Quick Facts
Patent No.
US 7,486,006
App. No.
11/318,342
Granted
Feb 3, 2009
Kind
B2
Abstract

A piezoelectric resonator includes a piezoelectric layer having a first resonance frequency temperature coefficient of a first sign, a first and a second electrode, the piezoelectric layer being arranged between the first and second electrodes, and a compensation layer arranged between the first electrode and the piezoelectric layer, of a compensation material having a second resonance frequency temperature coefficient of a second sign opposite to the first one, wherein the compensation material is provided with a modification material to increase a conductivity of the compensation layer in a direction of the first electrode and the piezoelectric layer.

Claims (22)

1. A piezoelectric resonator comprising:

a piezoelectric layer having a resonance frequency temperature coefficient of a first sign; a first and a second electrode, the piezoelectric layer being arranged between the first and second electrodes; and

a compensation layer arranged between the first electrode and the piezoelectric layer, comprising a compensation material having a second resonance frequency temperature coefficient of a second sign opposite to the first one, the compensation material being provided with a modification material to increase a conductivity of the compensation layer in a direction between the first electrode and the piezoelectric layer.

2. The piezoelectric resonator according to claim 1 , which is formed as a bulk acoustic wave resonator.

3. The piezoelectric resonator according to claim 1 , wherein the compensation material includes amorphous silicon dioxide.

4. The piezoelectric resonator according to claim 1 , further comprising a first acoustic densification layer between the first electrode and the compensation layer, the first acoustic densification layer having a higher acoustic impedance than the first electrode in the direction between the first electrode and the compensation layer.

5. The piezoelectric resonator according to claim 4 , wherein the first acoustic densification layer includes a conducting material.

6. The piezoelectric resonator according to claim 1 , comprising an acoustic densification layer between the second electrode and the piezoelectric layer, the acoustic densification layer having a higher acoustic impedance in the direction between the second electrode and the piezoelectric layer than the second electrode.

7. The piezoelectric resonator according to claim 6 , wherein the acoustic densification layer includes a conducting material.

8. The piezoelectric resonator according to claim 1 , wherein the modification material includes doping atoms introduced into the compensation material.

9. The piezoelectric resonator according to claim 1 , wherein the modification material includes a plurality of nanoparticles of a conductive material which are embedded into the compensation material as a matrix.

10. The piezoelectric resonator according to claim 9 , wherein the plurality of nanoparticles include a plurality of metallic nanoparticles.

11. The piezoelectric resonator according to claim 1 , wherein the modification material includes a plurality of metal threads.

12. The piezoelectric resonator according to claim 1 , wherein the compensation layer includes a first thin film including the modification material and a region including the compensation material disposed on the first thin film.

13. The piezoelectric resonator according to claim 12 , wherein the region including the compensation material is arranged between the first thin film including the modification material and a second thin film including the modification material.

14. The piezoelectric resonator according to claim 1 , wherein the modification material is arranged in holes in the compensation layer.

15. The piezoelectric resonator according to claim 14 , wherein the modification material includes a metal.

16. A piezoelectric resonator comprising:

a piezoelectric layer having a resonance frequency temperature coefficient of a first sign; a first and a second electrode, the piezoelectric layer being arranged between the first and second electrodes;

a compensation layer arranged between the first electrode and the piezoelectric layer, comprising a compensation material having a second resonance frequency temperature coefficient of a second sign opposite to the first one, the compensation material being provided with a modification material to increase a conductivity of the compensation layer in a direction between the first electrode and the piezoelectric layer; and

a cover layer including a conductive material, the cover layer arranged between the compensation layer and the piezoelectric layer.

17. The piezoelectric resonator according to claim 16 , wherein the conductive material in the cover layer includes a metal.

Assignments (3)
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0703 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2008
From: INFINEON TECHNOLOGIES AG
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 021580/0564 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2006
From: AIGNER, ROBERT
To: INFINEON TECHNOLOGIES AG
Reel/Frame 018216/0755 →