Apparatus for reducing parasitic capacitance in a semiconductor device
View Patent ↗A semiconductor device exhibiting low parasitic resistance comprises a first substrate characterized by a first resistivity; a second substrate characterized by a second resistivity, a third substrate and a metal element. These substrates form a multi-layer semiconductor device where the second substrate is formed on the first substrate; the third substrate is formed on the second substrate; and the metal element is formed on the third substrate. The second substrate is electrically grounded and is highly doped with acceptor dopant as compared to the first substrate. In this way, the second resistivity is lower than the first resistivity.
1. A semiconductor device, comprising:
a first substrate characterized by a first resistivity;
a ground layer formed on the first substrate;
a second substrate characterized by a second resistivity formed on the first substrate, in an opening of the ground layer;
a third substrate formed on the second substrate; and
a metal element formed on the third substrate,
wherein the second substrate is electrically coupled to the ground layer via a ground path formed in the second substrate, the ground path separate from any ground path provided by the first substrate, and
wherein the first resistivity is higher than the second resistivity.
2. The semiconductor device of claim 1 , wherein the metal element has a surface and a plane normal to the surface, and wherein the metal element is situated on the third substrate such that the normal plane intersects the second substrate.
3. The semiconductor device of claim 1 , wherein the metal element is an interconnection wire.
4. The semiconductor device of claim 1 , wherein the second substrate is highly doped with acceptor dopant as compared to the first substrate.
5. The semiconductor device of claim 1 , wherein the second substrate is doped to form a P+ doped region, wherein the P+ doped region is highly P doped as compared to the first substrate.
6. The semiconductor device of claim 1 , wherein the second substrate is electrically coupled to the ground layer via a ground wire.
7. The semiconductor device of claim 1 , wherein the second substrate is in contact with the ground layer.
8. A semiconductor device, comprising:
a first substrate layer formed on a first plane, the first substrate layer having a first resistivity;
a metal element formed on a second plane, wherein the second plane is substantially parallel to the first plane;
a ground layer formed on the first substrate layer, wherein the ground layer is located between the first and the second planes, and wherein the ground layer is electrically grounded; and
a second substrate layer having a second resistivity formed in an opening of the ground layer, wherein the second substrate layer is electrically coupled to the ground layer via a ground path formed in the second substrate layer, the ground path separate from any ground path provided by the first substrate layer,
wherein the first resistivity is higher than the second resistivity.
9. The semiconductor device of claim 8 , wherein the opening extends through the ground layer.
10. The semiconductor device of claim 8 , wherein the metal element has a third plane normal to the second plane, and wherein the metal element is situated on the second plane such that the third plane intersects the second substrate layer.
11. The semiconductor device of claim 8 , wherein the metal element is an interconnection wire.
12. The semiconductor device of claim 8 , wherein the second substrate layer is highly doped with acceptor dopant as compared to the first substrate layer.
13. The semiconductor device of claim 8 , wherein the second substrate layer is doped to form a P+ doped region, wherein the P+ doped region is highly P doped as compared to the first substrate layer.
14. The semiconductor device of claim 8 , wherein the second substrate layer is electrically coupled to the ground layer via a ground wire.
15. The semiconductor device of claim 8 , wherein the second substrate layer is in contact with the ground layer.