IP Library Granted Patent US 7,820,016
Granted Patent B2
US 7,820,016 · App. 11/320,565 · Granted Oct 26, 2010

Sputtering apparatus and method of preventing damage thereof

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,820,016
App. No.
11/320,565
Granted
Oct 26, 2010
Kind
B2
Abstract

A sputtering apparatus includes a container; a plate for supporting the container; a first attachment for attaching the container to the plate; and a second attachment for less tightly attaching the container to the plate than through the first attachment.

Claims (13)

1. A method of sputtering to prevent damage to a sputtering apparatus, comprising:

attaching a container to a plate through a first container fixing hole provided at a front side of the container by screwing a first screw without forming a gap between a head portion of the first screw and a first buffer; and

screwing the container only to the plate by sliding a second screw through a second container fixing hole provided at the front side of the container positioned opposite to the first container fixing hole,

wherein the second container fixing hole is larger than the first container fixing hole,

wherein including inserting a column portion of the second screw through the second container fixing hole and forming a head portion of the second screw integrally with the column portion, the head portion having a diameter larger than the diameter of the second container fixing hole, and

wherein the column portion of the second screw has a diameter narrower than the diameter of the second container fixing hole thereby forming a gap between the head portion of the second screw and a second buffer,

wherein both sides of the container is disposed on the plate,

wherein the second container fixing hole is configured to prevent damage when the sputtering apparatus expands by heat,

wherein a substrate is on the container, and

wherein the first and second buffers are interposed between the container and the plate.

2. The method of claim 1 , further comprising threading the first container fixing hole, and while leaving unthreaded the second container fixing hole.

3. The method of claim 2 , wherein the attaching the container to the plate including screwing the container both through the first container fixing hole and into the plate.

4. The method of claim 1 , wherein the diameter of the column portion is a fraction of the diameter of the second container fixing hole, and the fraction is in a range of about 0.3 to 0.7.

Assignments (2)
CHANGE OF NAME Recorded Oct 27, 2008
From: LG.PHILIPS LCD CO., LTD.
To: LG DISPLAY CO., LTD.
Reel/Frame 021772/0701 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2005
From: YUN, JINHEE; NA, MUNIK; LEE, SEUNGLYUL; KIM, KYOUNGSHIK; PARK, JUNHYUNG; PARK, SANGHYO; CHOI, JAEHOON; JUNG, KAGKYU; KIM, JAEKWANG
To: LG.PHILIPS LCD CO., LTD.
Reel/Frame 017426/0069 →