IP Library Patent Application 11324013
Patent Application
App. No. 11/324,013

Composite material

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Quick Facts
Patent No.
US None
App. No.
11/324,013
Abstract

A composite material includes polyimide and at least about 55 wt % non-carbonaceous filler. The composite material has a tensile strength at least about 44.9 MPa.

Claims (39)

1 . A composite material comprising polyimide and at least about 55 wt % non-carbonaceous filler, the composite material having a tensile strength at least about 44.9 MPa.

2 . The composite material of claim 1 , wherein the tensile strength is at least about 58.6 MPa.

3 .- 6 . (canceled)

7 . The composite material of claim 1 , wherein the composite material has a tensile strength performance at least about 0.9 relative to the polyimide absent the non-carbonaceous filler.

8 .- 11 . (canceled)

12 . The composite material of claim 1 , wherein the composite material comprises at least about 65 wt % of the non-carbonaceous filler.

13 . (canceled)

14 . The composite material of claim 1 , wherein the composite material comprises not greater than about 95 wt % of the non-carbonaceous filler.

15 . The composite material of claim 14 , wherein the composite material comprises not greater than about 90 wt % of the non-carbonaceous filler.

16 . (canceled)

17 . The composite material of claim 1 , wherein the composite material has a Young's modulus of at least about 2.5 GPa at 200° C.

18 .- 21 . (canceled)

22 . The composite material of claim 1 , wherein the composite material has a Young's modulus of at least about 20.0 GPa at 25° C.

23 . The composite material of claim 1 , wherein the composite material has a volume resistivity of about 1.0×10 4 ohm cm to about 1.0×10 8 ohm cm.

24 . The composite material of claim 23 , wherein the volume resistivity is not greater than about 5.0×10 6 ohm cm.

25 . The composite material of claim 24 , wherein the volume resistivity is not greater than about 1.0×10 5 ohm cm.

26 .- 28 . (canceled)

29 . The composite material of claim 1 , wherein the composite material has an elongation of at least about 0.5%.

30 . (canceled)

31 . The composite material of claim 1 , wherein the composite material has a coefficient of thermal expansion not greater than about 30 ppm/° C.

32 .- 33 . (canceled)

34 . The composite material of claim 1 , wherein the non-carbonaceous filler is selected from the group consisting of NiO, FeO, MnO, CO 2 O 3 , Cr 2 O 3 , CuO, Cu 2 O, Fe 2 O 3 , Ga 2 O 3 , In 2 O 3 , GeO 2 , MnO 2 , TiO 2-x , RuO 2 , Rh 2 O 3 , V 2 O 3 , Nb 2 O 5 , Ta 2 O 5 , WO 3 , SnO 2 , ZnO, CeO 2 , TiO 2-x , ITO (indium-tin oxide), MgTiO 3 , CaTiO 3 , BaTiO 3 , SrTiO 3 , LaCrO 3 , LaFeO 3 , LaMnO 3 , YMnO 3 , MgTiO 3 F, FeTiO 3 , SrSnO 3 , CaSnO 3 , LiNbO 3 , Fe 3 O 4 , MgFe 2 O 4 , MnFe 2 O 4 , CoFe 2 O 4 , NiFe 2 O 4 ZnFe 2 O 4 , Fe 2 O 4 , CoFe 2 O 4 , FeAl 2 O 4 , MnAl 2 O 4 , ZnAl 2 O 4 , ZnLa 2 O 4 , FeAl 2 O 4 , MgIn 2 O 4 , MnIn 2 O 4 , FeCr 2 O 4 , NiCr 2 O 4 , ZnGa 2 O 4 , LaTaO 4 , NdTaO 4 , BaFe 12 O 19 , 3Y 2 O 3 .5Fe 2 O 3 , Bi 2 Ru 2 O 7 , B 4 C, SiC, TiC, Ti(CN), Cr4C, VC, ZrC, TaC, WC, Si 3 N 4 , TiN, Ti(ON), ZrN, HfN, TiB 2 , ZrB 2 , CaB 6 , LaB 6 , NbB 2 , MoSi 2 , ZnS, Doped-Si, doped SiGe, III-V, II-VI semiconductors, and a mixture thereof.

35 . (canceled)

36 . The composite material of claim 1 , wherein the non-carbonaceous filler is a metal oxide.

37 . The composite material of claim 36 , wherein the metal oxide is an oxide of iron.

38 . The composite material of claim 36 , wherein the metal oxide is an oxide of copper.

39 . (canceled)

40 . The composite material of claim 1 , wherein the non-carbonaceous filler has an average particle size not greater than 1 micron.

41 .- 42 . (canceled)

43 . The composite material of claim 1 , wherein the polyimide is the imidized product of a dianhydride and a diamine.

44 .- 45 . (canceled)

46 . A composite material comprising polyimide and at least about 55 wt % non-carbonaceous filler, the composite material having a coefficient of thermal expansion not greater than about 30 ppm/° C.

47 . The composite material of claim 46 , wherein the coefficient of thermal expansion is not greater than about 25 ppm/° C.

48 .- 57 . (canceled)

58 . The composite material of claim 46 , wherein the composite material has a tensile strength performance of at least about 0.9 relative to the polyimide absent the non-carbonaceous filler.

59 .- 77 . (canceled)

78 . A composite material comprising polyimide and at least about 55 wt % non-carbonaceous filler, the composite material having a tensile strength performance of at least about 0.9 relative to the tensile strength of the polyimide absent non-carbonaceous filler.

79 . The composite material of claim 78 , wherein the tensile strength performance is at least about 0.95.

80 .- 106 . (canceled)

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 9, 2011
From: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
To: COORSTEK, INC.
Reel/Frame 026246/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2007
From: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
To: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
Reel/Frame 019823/0886 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2006
From: CZUBAROW, PAWEL; BELTZ, MARK W.; SWEI, GWO; KWON, OH-HUN
To: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
Reel/Frame 017490/0636 →