IP Library Granted Patent US 7,610,428
Granted Patent B2
US 7,610,428 · App. 11/324,732 · Granted Oct 27, 2009

System for providing a communication interface

Assignee: Augmentix Corporation
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Quick Facts
Patent No.
US 7,610,428
App. No.
11/324,732
Filed
Dec 30, 2005
Granted
Oct 27, 2009
Kind
B2
Art Unit
2182
USPC
710/301
Abstract

A system, providing a communication interface, is provided. The system includes an embedded device and a host. The embedded device includes an Ethernet controller that is connected to a communication bus on the host. The host includes device drivers of the Ethernet controller. Therefore, no special host-side software is required to establish the communication between the embedded device and the host.

Claims (73)

1. A system comprising:

a. an embedded device, the embedded device comprising:

i. a microprocessor, the microprocessor comprising a first Ethernet controller;

ii. a first Physical layer (PHY), wherein the first PHY is coupled to the first Ethernet controller through a physical transmission medium;

iii. a second Ethernet controller, the second Ethernet controller comprising a second PHY, wherein the second PHY is coupled to the first PHY through a physical transmission medium on the embedded device, wherein the first Ethernet controller, the first PHY the second PHY and the second Ethernet controller form a network on the embedded device;

iv. an electrical isolation medium; and

v. an interface operable to be physically coupled to a communication bus; and

vi. Power supply module, the power supply module providing a power supply to the embedded device.

b. a host, the host comprising the communication bus, wherein the interface of the embedded device is physically coupled to the communication bus, the host and the embedded device are electrically isolated from one another by the electrical isolation medium, the communication bus is coupled to the second Ethernet controller and the host is configured to communicate with the embedded device through the second Ethernet controller using only device drivers included with an operating system running on the host.

2. The system of claim 1 , wherein the communication bus comprises one or more of a Peripheral Component Interconnect (PCI) bus, a PCI extended (PCI-X) bus, and a PCI Express bus.

3. The system of claim 1 , wherein the embedded device further comprises:

a. a memory, the memory being coupled with the microprocessor; and

b. one or more Input/Output (I/O) devices, the one or more I/O devices being couple with the microprocessor.

4. The system of claim 1 , wherein the embedded device further comprises an Ethernet connector, the Ethernet connector providing a physical connection between the embedded device and an Ethernet network.

5. The system of claim 4 , wherein the embedded device is accessible from a remote host on the Ethernet network.

6. The system of claim 1 , wherein the microprocessor further comprises one or more applications, wherein the one or more applications are used for communicating with applications running on the host.

7. The system of claim 1 , wherein the embedded device further comprises an instrumentation processor, the instrumentation processor collecting information about the host, the instrumentation processor transmitting the information to the microprocessor.

8. The system of claim 7 , wherein the instrumentation processor comprises a micro-controller.

9. The system of claim 1 , wherein the embedded device further comprises a storage medium, the storage medium being capable of storing data.

10. An embedded device for communicating with a host, the embedded device comprising:

a. a microprocessor, the microprocessor comprising a first Ethernet controller;

b. an electrical isolation medium

c. a first Physical layer (PHY), wherein the first PHY is coupled to the first Ethernet controller through a physical transmission medium; and

d. a second Ethernet controller, the second Ethernet controller comprising a second PHY, where the second PHY is coupled to the first PHY through a physical transmission medium on the embedded device, wherein the first Ethernet controller, the first PHY the second PHY and the second Ethernet controller form a network on the embedded device and the second Ethernet controller is coupled to a communication bus comprised in the host through an interface physically coupled to the communication bus, wherein the host and the embedded device are electrically isolated from one another by the electrical isolation medium and the host is configured to communicate with the embedded device through the second Ethernet controller using only device drivers included with an operating system running on the host

e. Power supply module, the power supply module providing a power supply to the embedded device.

11. The embedded device of claim 10 further comprising:

a. a memory, the memory being coupled with the microprocessor; and

b. one or more Input/Output (I/O) devices, the one or more I/O devices being coupled with the microprocessor.

12. The embedded device of claim 10 , wherein the microprocessor further comprises one or more applications, where the one or more applications are used for communicating with applications running on the host.

13. The embedded device of claim 10 further comprising an Ethernet connector, the Ethernet connector providing a physical connection between the embedded device and an Ethernet network.

14. The embedded device of claim 13 is accessible from a remote host on the Ethernet network.

15. A system comprising:

an embedded device, the embedded device comprising:

a microprocessor, the microprocessor comprising a first Ethernet controller;

an electrical isolation medium;

an interface operable to be physically coupled to a communication bus;

a first Physical layer (PHY), wherein the first PHY is coupled to the first Ethernet controller through a physical transmission medium; and

a second Ethernet controller, the second Ethernet controller comprising a second PHY, wherein the second PHY is coupled to the first PHY through a physical transmission medium on the embedded device such that the first Ethernet controller, the first PHY the second PHY and the second Ethernet controller form a network on the embedded device; and

an instrumentation processor, the instrumentation processor collecting information about the host, the instrumentation processor transmitting the information to the microprocessor; and

a host, the host comprising the communication bus, wherein the interface of the embedded device is physically coupled to the communication bus, the host is electrically isolated from the embedded device by the electrical isolation medium the communication bus is couple to the second Ethernet controller and the host is configured to communicate with the embedded device through the second Ethernet controller using only device drivers included with an operating system running on the host Power supply module, the power supply module providing a power supply to the embedded device.

16. The system of claim 15 , wherein the communication bus comprises one or more of a Peripheral Component Interconnect (PCI) bus, a PCI extended (PCI-X) bus, and a PCI Express bus.

17. The system of claim 15 , wherein the embedded device further comprises:

a. a memory, the memory being coupled with the microprocessor; and

b. one or more Input/Output (I/O) devices, the one or more I/O devices being couple with the microprocessor.

18. The system of claim 15 , wherein the embedded device further comprises an Ethernet connector, the Ethernet connector providing a physical connection between the embedded device and an Ethernet network.

19. The system of claim 18 , wherein the embedded device is accessible from a remote host on the Ethernet network.

20. The system of claim 15 , wherein the microprocessor further comprises one or more applications, wherein the one or more applications are used for communicating with applications running on the host.

21. The system of claim 15 , wherein the instrumentation processor comprises a micro-controller.

22. The system of claim 15 , wherein the embedded device further comprises a storage medium, the storage medium being capable of storing data.

23. An embedded device for communicating with a host, the embedded device comprising:

a microprocessor, the microprocessor comprising a first Ethernet controller;

an electrical isolation medium;

an interface operable to be physically coupled to a communication bus;

a first Physical layer (PHY), wherein the first PHY is coupled to the first Ethernet controller through a physical transmission medium;

an instrumentation processor, the instrumentation processor collecting information about the host, the instrumentation processor transmitting the information to the microprocessor; and

a second Ethernet controller, the second Ethernet controller comprising a second PHY, where the second PHY is coupled to the first PHY through a physical transmission medium on the embedded device such that the first Ethernet controller, the first PHY the second PHY and the second Ethernet controller form a network on the embedded device, the second Ethernet controller operable to be coupled to a communication bus comprised in the host through an interface physically coupled to the communication bus, wherein the host and the embedded device are electrically isolated from one another by the electrical isolation medium and the host is configured to communicate with the embedded device through the second Ethernet controller using only device drivers included with an operating system running on the host Power supply module, the power supply module providing a power supply to the embedded device.

24. The embedded device of claim 23 further comprising:

c. a memory, the memory being coupled with the microprocessor; and

d. one or more Input/Output (I/O) devices, the one or more I/O devices being coupled with the microprocessor.

25. The embedded device of claim 23 wherein the microprocessor further comprises one or more applications, where the one or more applications are used for communicating with applications running on the host.

26. The embedded device of claim 23 further comprising an Ethernet connector, the Ethernet connector providing a physical connection between the embedded device and an Ethernet network.

27. The embedded device of claim 26 is accessible from a remote host on the Ethernet network.

28. A method of communicating between an application and a host, comprising:

sending a communication from a microprocessor on an embedded device to an application on a host through a communication bus of the host, wherein the embedded device is physically coupled to the communication bus using an interface and the embedded device comprises a first Ethernet controller, a first Physical layer (PHY), coupled to the first Ethernet controller through a physical transmission medium, a second Ethernet controller, the second Ethernet controller comprising a second PHY, wherein the second PHY is coupled to the first PHY through a physical transmission medium on the embedded device such that the first Ethernet controller, the first PHY the second PHY and the second Ethernet controller form a network on the embedded device and the embedded device is physically coupled to the communication bus using an interface, the host and the embedded device are electrically isolated from one another by the electrical isolation medium and the communication bus is couple to the second Ethernet controller and the host is configured to communicate with the embedded device through the second Ethernet controller using only device drivers included with an operating system running on the host; Embedded device further comprising power supply module, the power supply module providing a power supply to the embedded device; and

receiving the communication at the application on the host.

29. The method of claim 1 , wherein the communication bus comprises one or more of a Peripheral Component Interconnect (PCI) bus, a PCI extended (PCI-X) bus, and a PCI Express bus.

30. The method of claim 1 , wherein the embedded device further comprises:

e. a memory, the memory being coupled with the microprocessor; and

f. one or more Input/Output (I/O) devices, the one or more I/O devices being couple with the microprocessor.

31. The method of claim 1 , wherein the embedded device further comprises an Ethernet connector, the Ethernet connector providing a physical connection between the embedded device and an Ethernet network.

32. The method of claim 4 , wherein the embedded device is accessible from a remote host on the Ethernet network.

33. The method of claim 1 , wherein the embedded device further comprises an instrumentation processor, the instrumentation processor collecting information about the host, the instrumentation processor transmitting the information to the microprocessor.

34. The method of claim 7 , wherein the instrumentation processor comprises a micro-controller.

Assignments (16)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040040/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0618 →
RELEASE OF SECURITY INTEREST Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLANT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0216 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031899/0261 →
PATENT SECURITY AGREEMENT (ABL) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031898/0001 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jan 2, 2014
From: APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 031897/0348 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2013
From: AUGMENTIX CORPORATION
To: DELL PRODUCTS, L.P.
Reel/Frame 029775/0843 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2006
From: BARRON, JR., MATTHEW D.; GRABBE, TODD D.
To: AUGMENTIX CORPORATION
Reel/Frame 018587/0553 →
Continuity (1)
Related Publication 20070174466A1 · Jul 26, 2007