Method for making compositions containing microcapsules and compositions made thereof
In the process of the invention, a composition is made by mixing a plurality of microcapsules containing at least an additive such as lubricants, oils, fragrances, colorants, etc., with a dispersing polymeric material to form a first blend, and compounding the first blend into a base containing at least a polymeric material at a temperature of less than 370° C., whereas the resulting composition is substantially free of segregated microcapsules and heat degraded shell.
1 . A method for preparing a polymeric composition, comprising the steps of:
mixing a plurality of encapsulated materials containing at least an additive with a carrier polymeric material to form a first blend;
compounding the first blend into a polymer matrix comprising a polymer material same or different from the carrier polymeric material;
wherein the compounding is at a process temperature of less than 370° C.; and wherein
the resulting composition is substantially free of segregated microcapsules and heat degraded shell.
2 . The process of claim 1 , wherein the encapsulated materials are microcapsules or nanocapsules.
3 . The process of claim 1 , wherein the average diameter of the said encapsulated material is greater than 5 nm.
4 . The process of claim 1 , wherein the additive contained in the encapsulated materials is a phase change material selected from the group of lubricants, oils, fragrances, flavorants, catalysts, and mixtures thereof.
5 . The process of claim 1 , wherein the microcapsules contain at least one of lubricants, oils, and mixtures thereof.
6 . The process of claim 1 , wherein the compounding is carried out at a compounding temperature of less than 300° C.
7 . The process of claim 4 , wherein the compounding is carried out at a compounding temperature of less than 285° C.
8 . The process of claim 5 , wherein the compounding is carried out at a compounding temperature of less than 260° C.
9 . The process of claim 1 , wherein the microcapsules comprise a shell of polyoxymethylene urea (PMU).
10 . The process of claim 6 , characterized in that formaldehyde released from the heat degraded shell comprising polyoxymethylene urea is less than a MAC level.
11 . The process of claim 6 , characterized in that formaldehyde released from the heat degraded shell comprising polyoxymethylene urea is less than 1 ppm.
12 . The process of claim 1 , wherein the plurality of microcapsules containing a lubricating material is mixed with the carrier polymeric material by melt-blending and wherein the carrier polymeric material has a melting point of <285° C.
13 . The process of claim 9 , wherein the carrier polymeric material has a melting point of <260° C.
14 . The process of claim 1 , wherein the carrier polymeric material is selected from the group consisting of polyethylene terephthalate, polybutylene terephthalate, polycarbonate homopolymers, polyestercarbonate copolymers, linear aromatic polycarbonate resins, branched aromatic polycarbonate resins, poly(ester-carbonate) resins; polyamides, polyacetal, polyethylene, polypropylene, copolymers of olefins, halogenated vinyl polymers, vinylidene polymers, polyvinylidene chloride, polyvinyl fluoride, polyvinylidene fluoride, polyamide copolymers, styrene polymers, styrene copolymers, polyacrylonitrile, silicone resins, polyethers, polyketones, polyimides, modified celluloses, polysulphones and mixtures thereof.
15 . The process of claim 11 , wherein the carrier polymer is selected from the group consisting of polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyamide, polyimide, and mixtures thereof.
16 . The process of claim 1 , wherein the polymer matrix comprises a high-temperature material selected from the group of polyarylene sulfides, polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polyetherketone (PEK), polyphthalamide (PPA), polyetherketoneketone (PEKK), thermoplastic polyimide (TPI), high temperature nylon (HTN), polysulfone (PSU), polyethersulfone (PES), polyetherimide (PEI), and blends thereof.
17 . The process of claim 1 , wherein the plurality of microcapsules containing a lubricating material is mixed with the carrier polymeric material by dry-blending.
18 . The process of claim 1 , wherein the plurality of microcapsules containing a lubricating material is mixed with the carrier polymeric material by dry-blending or melt-blending to form a first blend, and wherein the first blend is compounded into a polymer matrix comprising a polymer material same or different from the carrier polymeric material, and wherein
the first blend is compounded into the polymer matrix through a downstream feeding point from the polymer matrix material.
19 . The process of claim 15 , wherein the downstream feeding point for the first blend is at a temperature of less than 285° C.
20 . The process of claim 16 , wherein the downstream feeding point is a side feeder of an extruder.
21 . The process of claim 1 , wherein said microcapsules have an average diameter of between 5 and 500 μm.
22 . The process of claim 18 , wherein said microcapsules have an average diameter of between 20 and 200 μm.
23 . The process of claim 1 , wherein the microcapsules are present in an amount of about 1 wt % to about 40 wt % of the total weight of the composition.
24 . The process of claim 20 , wherein the microcapsules are present in an amount of about 5 wt % to about 40 wt % of the total weight of the composition.
25 . The process of claim 1 , wherein the carrier polymeric material is present in an amount of about 5 wt % to about 40 wt % of the total weight of the composition.
26 . The process of claim 17 , wherein the carrier polymeric material present in an amount of about 5 wt % to about 30 wt % of the total weight of the composition.
27 . The process of claim 18 , wherein the carrier polymeric material is present in an amount of about 5 wt % to about 20 wt % of the total weight of the composition.
28 . The process of claim 1 , wherein the material comprising the polymer matrix is present in an amount of about 40 wt % to about 90 wt % of the total weight of the composition
29 . The process of claim 25 , wherein the material comprising the polymer matrix is present in an amount of about 50 wt % to about 80 wt % of the total weight of the composition
30 . The process of claim 26 , wherein the material comprising the polymer matrix is present in an amount of about 60 wt % to about 80 wt % of the total weight of the composition
31 . A composition made by the process of claim 1 .
32 . A composition comprising a plurality of microcapsules containing at least an additive, wherein
the plurality of microcapsules are first mixed into a carrier polymeric material forming a concentrate blend, and
the concentrate blend is subsequently compounded into a polymer matrix comprising a polymer material same or different from the carrier polymeric material, and wherein
the composition is substantially free of segregated microcapsules and heat degraded shell.
33 . The composition of claim 29 , wherein less than 10% of the microcapsules are segregated or having heat degraded shell.
34 . The composition of claim 30 , wherein less than 5% of the microcapsules are segregated or having heat degraded shell.
35 . The composition of claim 31 , wherein less than 3% of the microcapsules are segregated or having heat degraded shell.
36 . The composition of claim 29 , wherein the microcapsules contain at least a lubricant.
37 . The composition of claim 29 , wherein the carrier polymer comprises at least one of polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyamide, polyimide, and mixtures thereof.
38 . The composition of claim 29 , wherein the polymer matrix comprises a high-temperature material selected from the group of polyarylene sulfides, polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polyetherketone (PEK), polyphthalamide (PPA), polyetherketoneketone (PEKK), thermoplastic polyimide (TPI), high temperature nylon (HTN), polysulfone (PSU), polyethersulfone (PES), polyetherimide (PEI), and blends thereof.
39 . The composition of claim 29 , wherein the microcapsules are present in an amount of about 1.0 wt % to about 40 wt % of the total weight of the composition
40 . A composition comprising a plurality of microcapsules containing at least an additive, wherein
the plurality of microcapsules are first mixed into a carrier polymeric material forming a concentrate blend, and
the concentrate blend is subsequently compounded into a polymer matrix comprising a polymer material same or different from the carrier polymeric material, and wherein
the compounding is at a process temperature of less than 370° C.
41 . The composition of claim 33 , the compounding is at a process temperature of less than 300° C.