A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.
1. A sensor module comprising:
a housing;
a low temperature co-fired ceramic substrate located on the housing;
a first sensor located on the low temperature co-fired ceramic substrate, wherein the first sensor comprises a pressure sensor;
a second sensor located on a low temperature co-fired ceramic substrate, wherein the second sensor comprises an accelerometer;
signal processing circuitry located on the low temperature co-fired ceramic substrate; and
a metal shield substantially encapsulating at least one of the first and second sensors.
2. The sensor module as defined in claim 1 , wherein the metal shield comprises a first metal can overlying at least one of the first and second sensors on one side of the low temperature co-fired ceramic substrate, and a second metal can located on a second opposite side of the low temperature co-fired ceramic substrate.
3. The sensor module as defined in claim 2 , wherein the signal processing circuitry is located on the second side of the low temperature co-fired ceramic substrate and is at least partially encapsulated by the second metal can.
4. The sensor module as defined in claim 1 , wherein the signal processing circuitry comprises an ASIC.
5. The sensor module as defined in claim 1 , wherein the first sensor is formed on a first low temperature co-fired ceramic substrate arid has the first metal shield, and the second sensor is located on a second low temperature co-fired ceramic substrate and has a second metal shield.
6. The sensor module as defined in claim 1 , wherein the sensor is a vehicle crash sensor.
7. A vehicle crash sensor comprising:
a housing;
a low temperature co-fired ceramic substrate located on the housing;
a first sensor located on the low temperature co-fired ceramic substrate, wherein the first sensor comprises a pressure sensor;
a second sensor located on a low temperature co-fired ceramic substrate, said second sensor comprising an accelerometer;
signal processing circuitry located on the low temperature co-fired ceramic substrate; and
a metal shield on the low temperature co-fired ceramic substrate and substantially encapsulating at least one of the first and second sensors.
8. The sensor module as defined in claim 7 , wherein the metal shield comprises a first metal can overlying at least one of the first and second sensors on one side of the low temperature co-fired ceramic substrate, and a second metal can located on a second opposite side of the low temperature co-fired ceramic substrate.
9. The sensor module as defined in claim 8 , wherein the signal processing circuitry is located on the second side of the low temperature co-fired ceramic substrate and is at least partially encapsulated by the second metal can.
10. The sensor module as defined in claim 7 , wherein the signal processing circuitry comprises an ASIC.
11. The sensor module as defined in claim 7 , wherein the first sensor is formed on a first low temperature co-fired ceramic substrate and has the first metal shield, and the second sensor is located on a second low temperature co-fired ceramic substrate and has second metal shield.