OFET structures with both n- and p-type channels
View Patent ↗The present invention provides a dual organic field-effect transistor (OFET) structure and a method of fabricating the structure. The dual OFET structure includes an n-type organic semiconductor layer and a p-type organic semiconductor layer in contact with each other along an interface and forming a stack. The dual OFET structure also includes a source electrode and a drain electrode, the source and drain electrodes being in contact with one of the organic semiconductor layers. The dual OFET structure further includes first and second gate structures located on opposite sides of the stack. The first gate structure is configured to control a channel region of the n-type organic semiconductor layer, and the second gate structure is configured to control a channel region of the p-type organic semiconductor layer.
1. A method for fabricating a dual organic field effect transistor (OFET) structure, comprising:
forming a first gate structure on a substrate;
forming a stack over said first gate structure and over said substrate, said stack comprising a p-type organic semiconducting layer and an n-type organic semiconducting layer, said organic semiconducting layers being in contact along an interface;
forming a source electrode and a drain electrode; and
forming a second gate structure on an opposite side of said stack as said first gate structure; and
wherein said source and drain electrodes are in contact with one of said organic semiconductor layers, wherein said first gate structure is configured to control a channel region of said n-type organic semiconductor layer, and said second gate structure is configured to control a channel region of said p-type organic semiconductor layer.
2. The method as recited in claim 1 , wherein said source and drain electrodes contact only one of said organic semiconductor layers, wherein at least one of said source and drain electrodes is a source or drain electrode for a channel in said n-type organic semiconductor layer and for a channel in said p-type organic semiconductor layer.
3. The method as recited in claim 1 , wherein said n-type organic semiconductor layer and said p-type organic semiconductor layer have substantially a same footprint.
4. The method as recited in claim 1 , wherein said interface has a surface roughness of less than about 50 nanometers.
5. The method as recited in claim 1 , wherein forming said stack comprises:
depositing said p-type organic semiconducting layer and said n-type organic semiconducting layer over said substrate;
providing an etch-mask over said p-type organic semiconducting layer and said n-type organic semiconducting layer; and
etching both of said organic semiconducting layer under control of the etch-mask, to remove portions of both of said organic semiconducting layer.
6. The method as recited in claim 1 , wherein forming said stack comprises:
providing a mask over said substrate; and
depositing said p-type organic semiconducting layer and said n-type organic semiconducting layer through an opening in said mask.
7. The method as recited in claim 1 , wherein forming said stack comprises:
providing a resist layer over said substrate, said resist layer having an opening therein;
depositing said p-type organic semiconducting layer and said n-type organic semiconducting layer through said opening; and
removing said resist layer.
8. The method as recited in claim 1 , wherein forming said source and drain electrodes further includes forming a third electrode on said one of said organic semiconducting layers, wherein said first gate structure is in between said source electrode and said drain electrode, and said second gate structure is in between said drain electrode and said third electrode.
9. The method as recited in claim 1 , further includes:
forming a first dielectric layer in between said stack and said first gate electrode; and
forming a second dielectric layer in between said stack and said second gate electrode,
wherein at least one of said first or second dielectric layers are deposited after forming said stack using a solvent free process at a temperature of less than about 25° C.